Patent Assignment Details
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Reel/Frame: | 007348/0652 | |
| Pages: | 520 |
| | Recorded: | 02/03/1995 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/08/1997
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Application #:
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08384506
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Filing Dt:
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02/03/1995
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Title:
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SOLDER BUMP TRANSFER FOR MICROELECTRONICS PACKAGING AND ASSEMBLY
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Assignee
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13500 N. EXPRESSWAY, P.O. BOX 655474, M/S 219 |
DALLAS, TEXAS 75265 |
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Correspondence name and address
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03RENE E. GROSSMAN
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P.O. BOX 655474
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M/S 219
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13500 NO. CENTRAL EXPRESSWAY
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DALLAS, TX 75265
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