Patent Assignment Details
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| Reel/Frame: | 013571/0655 | |
| Pages: | 2 |
| | Recorded: | 12/12/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10317039
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Filing Dt:
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12/12/2002
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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Method for fabricating on stack structures in a semiconductor device
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Assignee
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| NO. 19, LI HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ETAL.
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YITAI HU
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005-3315
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