Patent Assignment Details
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| Reel/Frame: | 021583/0655 | |
| Pages: | 5 |
| | Recorded: | 09/24/2008 | | |
| Attorney Dkt #: | JCLA25033 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/07/2012
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Application #:
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12237035
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Filing Dt:
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09/24/2008
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Publication #:
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Pub Dt:
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04/09/2009
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Title:
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STACKED-TYPE CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
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Assignee
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| 26, CHIN 3RD. RD., 811, NANTZE EXPORT |
| PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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J. C. PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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