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10/21/2003
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03/30/2004
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11/23/2004
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08/05/2004
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METHOD FOR THE DEPOSITION OF A METAL LAYER COMPRISING A BETA-AMINO ACID
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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13431560
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Filing Dt:
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03/27/2012
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Publication #:
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Pub Dt:
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03/28/2013
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Title:
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ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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12/04/2012
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Application #:
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13545030
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Filing Dt:
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07/10/2012
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Publication #:
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Pub Dt:
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11/01/2012
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Title:
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SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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13556522
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Filing Dt:
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07/24/2012
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Publication #:
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Pub Dt:
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11/15/2012
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Title:
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COMPOSITE COATINGS FOR WHISKER REDUCTION
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Patent #:
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Issue Dt:
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05/10/2016
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Application #:
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13558019
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Filing Dt:
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07/25/2012
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Publication #:
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Pub Dt:
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01/30/2014
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Title:
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ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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04/11/2017
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Application #:
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13636087
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Filing Dt:
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02/04/2013
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Publication #:
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Pub Dt:
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11/28/2013
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Title:
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METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES
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Patent #:
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Issue Dt:
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03/24/2015
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Application #:
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13735779
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Filing Dt:
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01/07/2013
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Publication #:
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Pub Dt:
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07/18/2013
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Title:
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SILVER PLATING IN ELECTRONICS MANUFACTURE
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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13785946
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Filing Dt:
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03/05/2013
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Publication #:
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Pub Dt:
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09/19/2013
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Title:
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METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS
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Patent #:
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Issue Dt:
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01/21/2020
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Application #:
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13981974
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Filing Dt:
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01/08/2014
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Publication #:
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Pub Dt:
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05/01/2014
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Title:
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PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS
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Patent #:
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Issue Dt:
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11/15/2016
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Application #:
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14108954
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Filing Dt:
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12/17/2013
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Publication #:
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Pub Dt:
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04/17/2014
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Title:
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COPPER ELECTRODEPOSITION IN MICROELECTRONICS
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Patent #:
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Issue Dt:
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04/04/2017
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Application #:
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14325601
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Filing Dt:
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07/08/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Title:
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METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS
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Patent #:
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Issue Dt:
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01/03/2017
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Application #:
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14350971
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Filing Dt:
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04/10/2014
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Publication #:
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Pub Dt:
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09/11/2014
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Title:
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PROCESS FOR ELECTROLESS COPPER DEPOSITION ON LASER-DIRECT STRUCTURED SUBSTRATES
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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14630268
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Filing Dt:
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02/24/2015
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Publication #:
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Pub Dt:
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06/18/2015
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Title:
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BETA-AMINO ACID COMPRISING PLATING FORMULATION
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Patent #:
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Issue Dt:
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05/23/2017
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Application #:
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14962863
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Filing Dt:
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12/08/2015
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Publication #:
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Pub Dt:
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05/05/2016
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Title:
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CYANIDE-FREE ELECTROLYTE COMPOSITION AND METHOD FOR THE DEPOSITION OF SILVER OR SILVER ALLOY LAYERS ON SUBSTRATES
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