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Reel/Frame:	043029/0657			Pages:	6
		Recorded:	06/28/2017
Attorney Dkt #:	ZIP/IBT NAME CHANGE
Conveyance:	CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).

Total properties: 64

Patent #:	6368930	Issue Dt:	04/09/2002	Application #:	09165203	Filing Dt:	10/02/1998
Title:	SELF ALIGNED SYMMETRIC PROCESS AND DEVICE

Patent #:	6242794	Issue Dt:	06/05/2001	Application #:	09311149	Filing Dt:	05/13/1999
Title:	SELF- ALIGNED SYMMETRIC INTRINSIC DEVICE

Patent #:	6984571	Issue Dt:	01/10/2006	Application #:	09410054	Filing Dt:	10/01/1999
Title:	THREE DIMENSIONAL DEVICE INTERGRATION METHOD AND INTEGRATED DEVICE

Patent #:	6902987	Issue Dt:	06/07/2005	Application #:	09505283	Filing Dt:	02/16/2000
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	6500694	Issue Dt:	12/31/2002	Application #:	09532886	Filing Dt:	03/22/2000
Title:	THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Patent #:	6563133	Issue Dt:	05/13/2003	Application #:	09635272	Filing Dt:	08/09/2000
Title:	METHOD OF EPITAXIAL-LIKE WAFER BONDING AT LOW TEMPERATURE AND BONDED STRUCTURE

Patent #:	6740909	Issue Dt:	05/25/2004	Application #:	09822335	Filing Dt:	04/02/2001
Publication #:	US20010019873	Pub Dt:	09/06/2001
Title:	SELF ALIGNED SYMMETRIC INTRINSIC PROCESS AND DEVICE

Patent #:	6627531	Issue Dt:	09/30/2003	Application #:	09983808	Filing Dt:	10/25/2001
Publication #:	US20020064906	Pub Dt:	05/30/2002
Title:	THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Patent #:	7126212	Issue Dt:	10/24/2006	Application #:	10011432	Filing Dt:	12/11/2001
Publication #:	US20020094661	Pub Dt:	07/18/2002
Title:	THREE DIMENSIONAL DEVICE INTERGRATION METHOD AND INTERGRATED DEVICE

Patent #:	6756281	Issue Dt:	06/29/2004	Application #:	10096742	Filing Dt:	03/14/2002
Publication #:	US20020100916	Pub Dt:	08/01/2002
Title:	SELF ALIGNED SYMMETRIC INTRINSIC PROCESS AND DEVICE

Patent #:	6864585	Issue Dt:	03/08/2005	Application #:	10189014	Filing Dt:	07/05/2002
Publication #:	US20020164839	Pub Dt:	11/07/2002
Title:	THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Patent #:	6905557	Issue Dt:	06/14/2005	Application #:	10192702	Filing Dt:	07/11/2002
Publication #:	US20020173120	Pub Dt:	11/21/2002
Title:	THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Patent #:	6822326	Issue Dt:	11/23/2004	Application #:	10253588	Filing Dt:	09/25/2002
Publication #:	US20040058476	Pub Dt:	03/25/2004
Title:	WAFER BONDING HERMETIC ENCAPSULATION

Patent #:	7037755	Issue Dt:	05/02/2006	Application #:	10270318	Filing Dt:	10/15/2002
Publication #:	US20030119279	Pub Dt:	06/26/2003
Title:	THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Patent #:	7332410	Issue Dt:	02/19/2008	Application #:	10358141	Filing Dt:	02/05/2003
Publication #:	US20030141502	Pub Dt:	07/31/2003
Title:	METHOD OF EPITAXIAL-LIKE WAFER BONDING AT LOW TEMPERATURE AND BONDED STRUCTURE

Patent #:	6962835	Issue Dt:	11/08/2005	Application #:	10359608	Filing Dt:	02/07/2003
Publication #:	US20040157407	Pub Dt:	08/12/2004
Title:	METHOD FOR ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	7109092	Issue Dt:	09/19/2006	Application #:	10440099	Filing Dt:	05/19/2003
Publication #:	US20040235266	Pub Dt:	11/25/2004
Title:	METHOD OF ROOM TEMPERATURE COVALENT BONDING

Patent #:	7041178	Issue Dt:	05/09/2006	Application #:	10460418	Filing Dt:	06/13/2003
Publication #:	US20030211705	Pub Dt:	11/13/2003
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	6867073	Issue Dt:	03/15/2005	Application #:	10688910	Filing Dt:	10/21/2003
Title:	SINGLE MASK VIA METHOD AND DEVICE

Patent #:	7335572	Issue Dt:	02/26/2008	Application #:	10762318	Filing Dt:	01/23/2004
Publication #:	US20040152282	Pub Dt:	08/05/2004
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	7956447	Issue Dt:	06/07/2011	Application #:	10792757	Filing Dt:	03/05/2004
Publication #:	US20050194668	Pub Dt:	09/08/2005
Title:	WAFER SCALE DIE HANDLING

Patent #:	7622324	Issue Dt:	11/24/2009	Application #:	10913357	Filing Dt:	08/09/2004
Publication #:	US20050009246	Pub Dt:	01/13/2005
Title:	WAFER BONDING HERMETIC ENCAPSULATION

Patent #:	7387944	Issue Dt:	06/17/2008	Application #:	10913441	Filing Dt:	08/09/2004
Publication #:	US20050079712	Pub Dt:	04/14/2005
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	7341938	Issue Dt:	03/11/2008	Application #:	11008259	Filing Dt:	12/10/2004
Publication #:	US20050181542	Pub Dt:	08/18/2005
Title:	SINGLE MASK VIA METHOD AND DEVICE

Patent #:	7602070	Issue Dt:	10/13/2009	Application #:	11085131	Filing Dt:	03/22/2005
Publication #:	US20050161795	Pub Dt:	07/28/2005
Title:	ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	7462552	Issue Dt:	12/09/2008	Application #:	11134359	Filing Dt:	05/23/2005
Publication #:	US20060264004	Pub Dt:	11/23/2006
Title:	METHOD OF DETACHABLE DIRECT BONDING AT LOW TEMPERATURES

Patent #:	7485968	Issue Dt:	02/03/2009	Application #:	11201321	Filing Dt:	08/11/2005
Publication #:	US20070037379	Pub Dt:	02/15/2007
Title:	3D IC METHOD AND DEVICE

Patent #:	7335996	Issue Dt:	02/26/2008	Application #:	11442394	Filing Dt:	05/30/2006
Publication #:	US20060216904	Pub Dt:	09/28/2006
Title:	METHOD OF ROOM TEMPERATURE COVALENT BONDING

Patent #:	7842540	Issue Dt:	11/30/2010	Application #:	11758386	Filing Dt:	06/05/2007
Publication #:	US20070232023	Pub Dt:	10/04/2007
Title:	ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	7862885	Issue Dt:	01/04/2011	Application #:	11958071	Filing Dt:	12/17/2007
Publication #:	US20080187757	Pub Dt:	08/07/2008
Title:	METHOD OF ROOM TEMPERATURE COVALENT BONDING

Patent #:	7553744	Issue Dt:	06/30/2009	Application #:	11980415	Filing Dt:	10/31/2007
Publication #:	US20080063878	Pub Dt:	03/13/2008
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	7807549	Issue Dt:	10/05/2010	Application #:	11980664	Filing Dt:	10/31/2007
Publication #:	US20080053959	Pub Dt:	03/06/2008
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	7714446	Issue Dt:	05/11/2010	Application #:	12045555	Filing Dt:	03/10/2008
Publication #:	US20080150153	Pub Dt:	06/26/2008
Title:	SINGLE MASK VIA METHOD AND DEVICE

Patent #:	8389378	Issue Dt:	03/05/2013	Application #:	12270585	Filing Dt:	11/13/2008
Publication #:	US20090068831	Pub Dt:	03/12/2009
Title:	3D IC METHOD AND DEVICE

Patent #:	8053329	Issue Dt:	11/08/2011	Application #:	12493957	Filing Dt:	06/29/2009
Publication #:	US20090263953	Pub Dt:	10/22/2009
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	7871898	Issue Dt:	01/18/2011	Application #:	12720368	Filing Dt:	03/09/2010
Publication #:	US20100163169	Pub Dt:	07/01/2010
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	8524533	Issue Dt:	09/03/2013	Application #:	12913385	Filing Dt:	10/27/2010
Publication #:	US20110041329	Pub Dt:	02/24/2011
Title:	ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	8163373	Issue Dt:	04/24/2012	Application #:	12954735	Filing Dt:	11/26/2010
Publication #:	US20110143150	Pub Dt:	06/16/2011
Title:	METHOD OF ROOM TEMPERATURE COVALENT BONDING

Patent #:	8153505	Issue Dt:	04/10/2012	Application #:	12954740	Filing Dt:	11/26/2010
Publication #:	US20110067803	Pub Dt:	03/24/2011
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	8841002	Issue Dt:	09/23/2014	Application #:	13432682	Filing Dt:	03/28/2012
Publication #:	US20120183808	Pub Dt:	07/19/2012
Title:	METHOD OF ROOM TEMPERATURE COVALENT BONDING

Patent #:	8735219	Issue Dt:	05/27/2014	Application #:	13599023	Filing Dt:	08/30/2012
Publication #:	US20140061949	Pub Dt:	03/06/2014
Title:	HETEROGENEOUS ANNEALING METHOD AND DEVICE

Patent #:	8709938	Issue Dt:	04/29/2014	Application #:	13783553	Filing Dt:	03/04/2013
Publication #:	US20130178062	Pub Dt:	07/11/2013
Title:	3D IC METHOD AND DEVICE

Patent #:	8846450	Issue Dt:	09/30/2014	Application #:	13867928	Filing Dt:	04/22/2013
Publication #:	US20130233473	Pub Dt:	09/12/2013
Title:	ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	9184125	Issue Dt:	11/10/2015	Application #:	14064807	Filing Dt:	10/28/2013
Publication #:	US20140061942	Pub Dt:	03/06/2014
Title:	HETEROGENEOUS ANNEALING METHOD AND DEVICE

Patent #:	9082627	Issue Dt:	07/14/2015	Application #:	14197070	Filing Dt:	03/04/2014
Publication #:	US20140206176	Pub Dt:	07/24/2014
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	9171756	Issue Dt:	10/27/2015	Application #:	14198723	Filing Dt:	03/06/2014
Publication #:	US20140187040	Pub Dt:	07/03/2014
Title:	3D IC METHOD AND DEVICE

Patent #:	9385024	Issue Dt:	07/05/2016	Application #:	14474476	Filing Dt:	09/02/2014
Publication #:	US20140370658	Pub Dt:	12/18/2014
Title:	ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	10434749	Issue Dt:	10/08/2019	Application #:	14474501	Filing Dt:	09/02/2014
Publication #:	US20150064498	Pub Dt:	03/05/2015
Title:	METHOD OF ROOM TEMPERATURE COVALENT BONDING

Patent #:	9564414	Issue Dt:	02/07/2017	Application #:	14746425	Filing Dt:	06/22/2015
Publication #:	US20150287692	Pub Dt:	10/08/2015
Title:	THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Patent #:	9331149	Issue Dt:	05/03/2016	Application #:	14754111	Filing Dt:	06/29/2015
Publication #:	US20150303263	Pub Dt:	10/22/2015
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	9716033	Issue Dt:	07/25/2017	Application #:	14813972	Filing Dt:	07/30/2015
Publication #:	US20150340285	Pub Dt:	11/26/2015
Title:	3D IC METHOD AND DEVICE

Patent #:	9953941	Issue Dt:	04/24/2018	Application #:	14835379	Filing Dt:	08/25/2015
Publication #:	US20170062366	Pub Dt:	03/02/2017
Title:	CONDUCTIVE BARRIER DIRECT HYBRID BONDING

Patent #:	9698126	Issue Dt:	07/04/2017	Application #:	14879800	Filing Dt:	10/09/2015
Publication #:	US20160099233	Pub Dt:	04/07/2016
Title:	HETEROGENEOUS ANNEALING METHOD AND DEVICE

Patent #:	9391143	Issue Dt:	07/12/2016	Application #:	14957501	Filing Dt:	12/02/2015
Publication #:	US20160086913	Pub Dt:	03/24/2016
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	10141218	Issue Dt:	11/27/2018	Application #:	14959204	Filing Dt:	12/04/2015
Publication #:	US20160086899	Pub Dt:	03/24/2016
Title:	ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	9431368	Issue Dt:	08/30/2016	Application #:	15064467	Filing Dt:	03/08/2016
Publication #:	US20160190093	Pub Dt:	06/30/2016
Title:	THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Patent #:	10204893	Issue Dt:	02/12/2019	Application #:	15159649	Filing Dt:	05/19/2016
Publication #:	US20170338214	Pub Dt:	11/23/2017
Title:	STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

Patent #:	10312217	Issue Dt:	06/04/2019	Application #:	15205346	Filing Dt:	07/08/2016
Publication #:	US20160322328	Pub Dt:	11/03/2016
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	9852988	Issue Dt:	12/26/2017	Application #:	15379942	Filing Dt:	12/15/2016
Publication #:	US20170179029	Pub Dt:	06/22/2017
Title:	INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING

Patent #:	10366962	Issue Dt:	07/30/2019	Application #:	15385545	Filing Dt:	12/20/2016
Publication #:	US20170170132	Pub Dt:	06/15/2017
Title:	THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Patent #:	10002844	Issue Dt:	06/19/2018	Application #:	15387385	Filing Dt:	12/21/2016
Publication #:	US20180174995	Pub Dt:	06/21/2018
Title:	BONDED STRUCTURES

Patent #:	10446532	Issue Dt:	10/15/2019	Application #:	15389157	Filing Dt:	12/22/2016
Publication #:	US20170200711	Pub Dt:	07/13/2017
Title:	SYSTEMS AND METHODS FOR EFFICIENT TRANSFER OF SEMICONDUCTOR ELEMENTS

Patent #:	10276909	Issue Dt:	04/30/2019	Application #:	15395197	Filing Dt:	12/30/2016
Publication #:	US20180191047	Pub Dt:	07/05/2018
Title:	STRUCTURE WITH INTEGRATED METALLIC WAVEGUIDE

Patent #:	NONE	Issue Dt:		Application #:	15426942	Filing Dt:	02/07/2017
Publication #:	US20180190583	Pub Dt:	07/05/2018
Title:	BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

Assignor

ZIPTRONIX , INC.

Exec Dt:

05/26/2017

Assignee

INVENSAS BONDING TECHNOLOGIES, INC.

3025 ORCHARD PARKWAY

SAN JOSE, CALIFORNIA 95134

Correspondence name and address
	CHRISTOPHER LATTIN
	3025 ORCHARD PARKWAY
	C/O: TESSSERA INTELLECTUAL PROPERTY CORP
	SAN JOSE, CA 95134

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