Patent Assignment Details
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Reel/Frame: | 007003/0658 | |
| Pages: | 2 |
| | Recorded: | 05/03/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08237709
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Filing Dt:
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05/03/1994
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Title:
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PACKAGED SEMICONDUCTOR DIE INCLUDING HEAT SINK WITH LOCKING FEATURE
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Assignee
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SUITE 100 |
1347 N. ALMA SCHOOL ROAD |
CHANDLER, ARIZONA 85224 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON,
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FRANKLIN & FRIEL
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ALAN H. MACPHERSON
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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