Patent Assignment Details
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| Reel/Frame: | 053095/0658 | |
| Pages: | 10 |
| | Recorded: | 04/13/2020 | | |
| Attorney Dkt #: | SHLP0009USA4 |
| Conveyance: | INHERITANCE SYSTEM TABLE FOR PATENT APPLICATION |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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16798449
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Filing Dt:
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02/24/2020
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Publication #:
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Pub Dt:
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06/18/2020
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Title:
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SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND IMPROVED HEAT-DISSIPATION PERFORMANCE
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Assignees
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| NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN |
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| 8F., NO. 38, LN. 168, SONGDE RD., XINYI DIST. |
| TAIPEI CITY, TAIWAN |
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| 3F., NO. 39, LN. 236, SEC. 5, ZHONGXIAO E. RD., XINYI DIST. |
| TAIPEI CITY, TAIWAN |
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| 13F, NO. 90, SONGKAO RD., XINYI DISTRICT |
| TAIPEI CITY, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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06/17/2024 02:32 PM
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