Total properties:
26
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Patent #:
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Issue Dt:
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11/04/2014
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Application #:
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12732868
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Filing Dt:
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03/26/2010
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Publication #:
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Pub Dt:
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09/30/2010
| | | | |
Title:
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METHODS OF FORMING PRINTABLE INTEGRATED CIRCUIT DEVICES BY SELECTIVE ETCHING TO SUSPEND THE DEVICES FROM A HANDLING SUBSTRATE AND DEVICES FORMED THEREBY
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Patent #:
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Issue Dt:
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02/20/2018
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Application #:
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13302497
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Filing Dt:
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11/22/2011
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Publication #:
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Pub Dt:
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05/24/2012
| | | | |
Title:
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INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRATED CIRCUIT ELEMENTS WITH IMPROVED INTERCONNECTION ALIGNMENT TOLERANCE
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Patent #:
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Issue Dt:
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11/18/2014
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Application #:
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13491196
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Filing Dt:
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06/07/2012
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Publication #:
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Pub Dt:
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12/13/2012
| | | | |
Title:
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METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS
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Patent #:
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Issue Dt:
|
11/15/2016
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Application #:
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13638019
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Filing Dt:
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06/07/2013
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Publication #:
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Pub Dt:
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10/17/2013
| | | | |
Title:
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METHODS OF SELECTIVELY TRANSFERRING ACTIVE COMPONENTS
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Patent #:
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Issue Dt:
|
06/02/2015
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Application #:
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13638040
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Filing Dt:
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02/25/2013
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Publication #:
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Pub Dt:
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06/20/2013
| | | | |
Title:
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ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
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Patent #:
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Issue Dt:
|
09/22/2015
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Application #:
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13818901
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Filing Dt:
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05/08/2013
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Publication #:
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Pub Dt:
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08/29/2013
| | | | |
Title:
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STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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14334179
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Filing Dt:
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07/17/2014
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Publication #:
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Pub Dt:
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03/19/2015
| | | | |
Title:
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Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
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Patent #:
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Issue Dt:
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04/05/2016
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Application #:
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14541276
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Filing Dt:
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11/14/2014
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Publication #:
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Pub Dt:
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05/21/2015
| | | | |
Title:
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METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS
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Patent #:
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Issue Dt:
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09/13/2016
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Application #:
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14708893
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Filing Dt:
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05/11/2015
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Publication #:
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Pub Dt:
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12/31/2015
| | | | |
Title:
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METHODS OF FORMING PRINTABLE INTEGRATED CIRCUIT DEVICES AND DEVICES FORMED THEREBY
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Patent #:
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NONE
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Issue Dt:
|
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Application #:
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14715191
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Filing Dt:
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05/18/2015
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Publication #:
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Pub Dt:
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11/12/2015
| | | | |
Title:
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Electrically Bonded Arrays of Transfer Printed Active Components
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Patent #:
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Issue Dt:
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03/20/2018
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Application #:
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14831236
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Filing Dt:
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08/20/2015
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Publication #:
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Pub Dt:
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12/31/2015
| | | | |
Title:
|
STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS
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|
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Patent #:
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|
Issue Dt:
|
02/20/2018
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Application #:
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15243228
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Filing Dt:
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08/22/2016
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Publication #:
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Pub Dt:
|
05/11/2017
| | | | |
Title:
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PRINTABLE DEVICE WAFERS WITH SACRIFICIAL LAYERS GAPS
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|
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Patent #:
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Issue Dt:
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09/17/2019
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Application #:
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15863164
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Filing Dt:
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01/05/2018
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Publication #:
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|
Pub Dt:
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05/10/2018
| | | | |
Title:
|
INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRATED CIRCUIT ELEMENTS WITH IMPROVED INTERCONNECTION ALIGNMENT TOLERANCE
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|
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Patent #:
|
|
Issue Dt:
|
12/25/2018
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Application #:
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15864813
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Filing Dt:
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01/08/2018
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Publication #:
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|
Pub Dt:
|
05/10/2018
| | | | |
Title:
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PRINTABLE DEVICE WAFERS WITH SACRIFICIAL LAYERS
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|
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Patent #:
|
|
Issue Dt:
|
12/31/2019
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Application #:
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16192751
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Filing Dt:
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11/15/2018
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Publication #:
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Pub Dt:
|
03/21/2019
| | | | |
Title:
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METHODS OF MAKING PRINTABLE DEVICE WAFERS WITH SACRIFICIAL LAYERS
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|
|
Patent #:
|
|
Issue Dt:
|
09/29/2020
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Application #:
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16207690
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Filing Dt:
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12/03/2018
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Publication #:
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|
Pub Dt:
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06/04/2020
| | | | |
Title:
|
PRINTED COMPONENTS ON SUBSTRATE POSTS
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|
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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16207738
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Filing Dt:
|
12/03/2018
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Publication #:
|
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Pub Dt:
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06/04/2020
| | | | |
Title:
|
MODULE STRUCTURES WITH COMPONENT ON SUBSTRATE POST
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|
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Patent #:
|
|
Issue Dt:
|
10/25/2022
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Application #:
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16207774
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Filing Dt:
|
12/03/2018
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Publication #:
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Pub Dt:
|
06/04/2020
| | | | |
Title:
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PRINTING COMPONENTS OVER SUBSTRATE POST EDGES
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|
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Patent #:
|
|
Issue Dt:
|
08/18/2020
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Application #:
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16274969
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Filing Dt:
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02/13/2019
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Publication #:
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Pub Dt:
|
08/13/2020
| | | | |
Title:
|
PRINTING COMPONENT ARRAYS WITH DIFFERENT ORIENTATIONS
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
16297427
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Filing Dt:
|
03/08/2019
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Publication #:
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Pub Dt:
|
06/04/2020
| | | | |
Title:
|
CAVITY STRUCTURES
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|
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Patent #:
|
|
Issue Dt:
|
07/14/2020
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Application #:
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16408155
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Filing Dt:
|
05/09/2019
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Title:
|
High-Precision Printed Structures
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|
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Patent #:
|
|
Issue Dt:
|
03/09/2021
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Application #:
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16442142
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Filing Dt:
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06/14/2019
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Publication #:
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Pub Dt:
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12/17/2020
| | | | |
Title:
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PIXEL MODULES WITH CONTROLLERS AND LIGHT EMITTERS
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|
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Patent #:
|
|
Issue Dt:
|
08/24/2021
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Application #:
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16532591
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Filing Dt:
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08/06/2019
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Publication #:
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Pub Dt:
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02/11/2021
| | | | |
Title:
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STRUCTURES AND METHODS FOR ELECTRICALLY CONNECTING PRINTED COMPONENTS
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|
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Patent #:
|
|
Issue Dt:
|
09/21/2021
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Application #:
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16669493
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Filing Dt:
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10/30/2019
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Publication #:
|
|
Pub Dt:
|
05/06/2021
| | | | |
Title:
|
DISPLAYS WITH UNPATTERNED LAYERS OF LIGHT-ABSORBING MATERIAL
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|
|
Patent #:
|
|
Issue Dt:
|
03/09/2021
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Application #:
|
16697104
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Filing Dt:
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11/26/2019
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Publication #:
|
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Pub Dt:
|
03/26/2020
| | | | |
Title:
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WAFERS WITH ETCHABLE SACRIFICIAL PATTERNS, ANCHORS, TETHERS, AND PRINTABLE DEVICES
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|
|
Patent #:
|
|
Issue Dt:
|
03/22/2022
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Application #:
|
16702352
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Filing Dt:
|
12/03/2019
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Publication #:
|
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Pub Dt:
|
06/18/2020
| | | | |
Title:
|
LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES
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|