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Patent Assignment Details
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Reel/Frame:012928/0661   Pages: 9
Recorded: 05/30/2002
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 22
1
Patent #:
Issue Dt:
08/03/2004
Application #:
09132638
Filing Dt:
08/11/1998
Publication #:
Pub Dt:
05/23/2002
Title:
RESIN/COPPER/METAL LAMINATE AND METHOD OF PRODUCING SAME
2
Patent #:
Issue Dt:
07/31/2001
Application #:
09266951
Filing Dt:
03/12/1999
Title:
LAMINATE FOR MULTI-LAYER PRINTED CIRCUIT
3
Patent #:
Issue Dt:
11/14/2000
Application #:
09266952
Filing Dt:
03/12/1999
Title:
FLEXIBLE LAMINATE FOR FLEXIBLE CIRCUIT
4
Patent #:
Issue Dt:
05/29/2001
Application #:
09269316
Filing Dt:
03/24/1999
Title:
COMPONENT OF PRINTED CIRCUIT BOARDS
5
Patent #:
Issue Dt:
08/15/2000
Application #:
09277101
Filing Dt:
03/26/1999
Title:
MULTI- LAYER LAMINATE AND METHOD OF PRODUCING SAME
6
Patent #:
Issue Dt:
02/06/2001
Application #:
09337576
Filing Dt:
06/22/1999
Title:
ANODE STRUCTURE FOR MANUFACTURE OF METALLIC FOIL
7
Patent #:
Issue Dt:
10/02/2001
Application #:
09397404
Filing Dt:
09/16/1999
Title:
COPPER COATED POLYIMIDE WITH METALLIC PROTECTIVE LAYER
8
Patent #:
Issue Dt:
04/23/2002
Application #:
09400392
Filing Dt:
09/21/1999
Title:
RESIN/COPPER/METAL LAMINATE AND METHOD OF PRODUCING SAME
9
Patent #:
Issue Dt:
12/03/2002
Application #:
09500192
Filing Dt:
02/08/2000
Title:
METHOD OF FORMING CHROMIUM COATED COPPER FOR PRINTED CIRCUIT BOARDS
10
Patent #:
Issue Dt:
01/29/2002
Application #:
09530991
Filing Dt:
05/08/2000
Title:
SHEET STACKING DEVICE
11
Patent #:
Issue Dt:
04/30/2002
Application #:
09566289
Filing Dt:
05/05/2000
Title:
Component of printed circuit board
12
Patent #:
Issue Dt:
05/01/2001
Application #:
09591666
Filing Dt:
06/12/2000
Title:
Method of forming a flexible laminate for flexible circuit
13
Patent #:
Issue Dt:
03/26/2002
Application #:
09604630
Filing Dt:
06/27/2000
Title:
Electroforming cell
14
Patent #:
Issue Dt:
12/03/2002
Application #:
09628766
Filing Dt:
07/31/2000
Title:
APPLYING RESISTIVE LAYER ONTO COPPER
15
Patent #:
Issue Dt:
11/13/2001
Application #:
09641303
Filing Dt:
08/18/2000
Title:
Component for use in forming printed circuit boards
16
Patent #:
Issue Dt:
09/04/2001
Application #:
09641304
Filing Dt:
08/18/2000
Title:
Method and component for forming an embedded resistor in a multi-layer printed circuit
17
Patent #:
Issue Dt:
09/10/2002
Application #:
09649922
Filing Dt:
08/29/2000
Title:
THIN COPPER ON USABLE CARRIER AND METHOD OF FORMING SAME
18
Patent #:
Issue Dt:
09/23/2003
Application #:
09667294
Filing Dt:
09/22/2000
Title:
RESISTOR COMPONENT WITH MULTIPLE LAYERS OF RESISTIVE MATERIAL
19
Patent #:
Issue Dt:
01/06/2004
Application #:
09792717
Filing Dt:
02/23/2001
Publication #:
Pub Dt:
08/29/2002
Title:
CORROSION PREVENTION FOR CAC COMPONENT
20
Patent #:
NONE
Issue Dt:
Application #:
09825803
Filing Dt:
04/04/2001
Publication #:
Pub Dt:
10/10/2002
Title:
Resistor foil
21
Patent #:
NONE
Issue Dt:
Application #:
09826623
Filing Dt:
04/05/2001
Publication #:
Pub Dt:
02/21/2002
Title:
Component for use in forming printed circuit boards
22
Patent #:
NONE
Issue Dt:
Application #:
09826636
Filing Dt:
04/05/2001
Publication #:
Pub Dt:
05/02/2002
Title:
Method and component for forming an embedded resistor in a multi-layer printed circuit
Assignor
1
Exec Dt:
04/17/2002
Assignee
1
34929 CURTIS BOULEVARD
EASTLAKE, OHIO 44095
Correspondence name and address
MARK KUSNER CO., LPA
MARK KUSNER, ESQ.
6151 WILSON MILLS ROAD
HIGHLAND HEIGHTS, OH 44143

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