Total properties:
22
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Patent #:
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Issue Dt:
|
08/03/2004
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Application #:
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09132638
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Filing Dt:
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08/11/1998
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Publication #:
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Pub Dt:
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05/23/2002
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Title:
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RESIN/COPPER/METAL LAMINATE AND METHOD OF PRODUCING SAME
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Patent #:
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Issue Dt:
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07/31/2001
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Application #:
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09266951
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Filing Dt:
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03/12/1999
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Title:
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LAMINATE FOR MULTI-LAYER PRINTED CIRCUIT
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Patent #:
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Issue Dt:
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11/14/2000
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Application #:
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09266952
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Filing Dt:
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03/12/1999
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Title:
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FLEXIBLE LAMINATE FOR FLEXIBLE CIRCUIT
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09269316
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Filing Dt:
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03/24/1999
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Title:
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COMPONENT OF PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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08/15/2000
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Application #:
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09277101
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Filing Dt:
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03/26/1999
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Title:
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MULTI- LAYER LAMINATE AND METHOD OF PRODUCING SAME
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Patent #:
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|
Issue Dt:
|
02/06/2001
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Application #:
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09337576
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Filing Dt:
|
06/22/1999
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Title:
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ANODE STRUCTURE FOR MANUFACTURE OF METALLIC FOIL
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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09397404
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Filing Dt:
|
09/16/1999
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Title:
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COPPER COATED POLYIMIDE WITH METALLIC PROTECTIVE LAYER
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Patent #:
|
|
Issue Dt:
|
04/23/2002
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Application #:
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09400392
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Filing Dt:
|
09/21/1999
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Title:
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RESIN/COPPER/METAL LAMINATE AND METHOD OF PRODUCING SAME
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|
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Patent #:
|
|
Issue Dt:
|
12/03/2002
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Application #:
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09500192
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Filing Dt:
|
02/08/2000
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Title:
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METHOD OF FORMING CHROMIUM COATED COPPER FOR PRINTED CIRCUIT BOARDS
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Patent #:
|
|
Issue Dt:
|
01/29/2002
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Application #:
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09530991
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Filing Dt:
|
05/08/2000
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Title:
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SHEET STACKING DEVICE
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Patent #:
|
|
Issue Dt:
|
04/30/2002
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Application #:
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09566289
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Filing Dt:
|
05/05/2000
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Title:
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Component of printed circuit board
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|
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Patent #:
|
|
Issue Dt:
|
05/01/2001
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Application #:
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09591666
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Filing Dt:
|
06/12/2000
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Title:
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Method of forming a flexible laminate for flexible circuit
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Patent #:
|
|
Issue Dt:
|
03/26/2002
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Application #:
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09604630
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Filing Dt:
|
06/27/2000
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Title:
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Electroforming cell
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|
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Patent #:
|
|
Issue Dt:
|
12/03/2002
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Application #:
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09628766
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Filing Dt:
|
07/31/2000
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Title:
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APPLYING RESISTIVE LAYER ONTO COPPER
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|
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Patent #:
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|
Issue Dt:
|
11/13/2001
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Application #:
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09641303
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Filing Dt:
|
08/18/2000
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Title:
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Component for use in forming printed circuit boards
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|
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Patent #:
|
|
Issue Dt:
|
09/04/2001
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Application #:
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09641304
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Filing Dt:
|
08/18/2000
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Title:
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Method and component for forming an embedded resistor in a multi-layer printed circuit
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|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
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Application #:
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09649922
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Filing Dt:
|
08/29/2000
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Title:
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THIN COPPER ON USABLE CARRIER AND METHOD OF FORMING SAME
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|
|
Patent #:
|
|
Issue Dt:
|
09/23/2003
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Application #:
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09667294
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Filing Dt:
|
09/22/2000
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Title:
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RESISTOR COMPONENT WITH MULTIPLE LAYERS OF RESISTIVE MATERIAL
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|
|
Patent #:
|
|
Issue Dt:
|
01/06/2004
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Application #:
|
09792717
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Filing Dt:
|
02/23/2001
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Publication #:
|
|
Pub Dt:
|
08/29/2002
| | | | |
Title:
|
CORROSION PREVENTION FOR CAC COMPONENT
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|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
09825803
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Filing Dt:
|
04/04/2001
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Publication #:
|
|
Pub Dt:
|
10/10/2002
| | | | |
Title:
|
Resistor foil
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
09826623
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Filing Dt:
|
04/05/2001
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Publication #:
|
|
Pub Dt:
|
02/21/2002
| | | | |
Title:
|
Component for use in forming printed circuit boards
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
09826636
|
Filing Dt:
|
04/05/2001
|
Publication #:
|
|
Pub Dt:
|
05/02/2002
| | | | |
Title:
|
Method and component for forming an embedded resistor in a multi-layer printed circuit
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|