Total properties:
43
|
|
Patent #:
|
|
Issue Dt:
|
11/16/2004
|
Application #:
|
10640539
|
Filing Dt:
|
08/13/2003
|
Publication #:
|
|
Pub Dt:
|
02/19/2004
| | | | |
Title:
|
WAFER LEVEL PACKAGE AND THE PROCESS OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2008
|
Application #:
|
10725933
|
Filing Dt:
|
12/03/2003
|
Publication #:
|
|
Pub Dt:
|
06/09/2005
| | | | |
Title:
|
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10833345
|
Filing Dt:
|
04/28/2004
|
Publication #:
|
|
Pub Dt:
|
11/03/2005
| | | | |
Title:
|
STRUCTURE OF IMAGE SENSOR MODULE AND A METHOD FOR MANUFACTURING OF WAFER LEVEL PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/21/2007
|
Application #:
|
10835571
|
Filing Dt:
|
04/30/2004
|
Publication #:
|
|
Pub Dt:
|
11/03/2005
| | | | |
Title:
|
STRUCTURE OF PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2007
|
Application #:
|
10918416
|
Filing Dt:
|
08/16/2004
|
Publication #:
|
|
Pub Dt:
|
02/16/2006
| | | | |
Title:
|
PACKAGE STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/03/2007
|
Application #:
|
10973557
|
Filing Dt:
|
10/26/2004
|
Publication #:
|
|
Pub Dt:
|
04/27/2006
| | | | |
Title:
|
CHIP-SIZE PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/28/2009
|
Application #:
|
11025746
|
Filing Dt:
|
12/29/2004
|
Publication #:
|
|
Pub Dt:
|
11/03/2005
| | | | |
Title:
|
IMAGE SENSOR WITH A PROTECTION LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/15/2008
|
Application #:
|
11026488
|
Filing Dt:
|
12/30/2004
|
Publication #:
|
|
Pub Dt:
|
07/06/2006
| | | | |
Title:
|
PACKAGING STRUCTURE WITH COPLANAR FILLING PASTE AND DICE AND WITH PATTERNED GLUE FOR WL-CSP
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2007
|
Application #:
|
11029929
|
Filing Dt:
|
01/05/2005
|
Publication #:
|
|
Pub Dt:
|
07/06/2006
| | | | |
Title:
|
FBGA AND COB PACKAGE STRUCTURE FOR IMAGE SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
07/26/2011
|
Application #:
|
11158167
|
Filing Dt:
|
06/20/2005
|
Publication #:
|
|
Pub Dt:
|
11/10/2005
| | | | |
Title:
|
MANUFACTURING TOOL FOR WAFER LEVEL PACKAGE AND METHOD OF PLACING DIES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/28/2007
|
Application #:
|
11169722
|
Filing Dt:
|
06/30/2005
|
Publication #:
|
|
Pub Dt:
|
10/27/2005
| | | | |
Title:
|
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/13/2007
|
Application #:
|
11175420
|
Filing Dt:
|
07/06/2005
|
Publication #:
|
|
Pub Dt:
|
01/11/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PROTECTIVE STRUCTURE AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2008
|
Application #:
|
11235485
|
Filing Dt:
|
09/26/2005
|
Publication #:
|
|
Pub Dt:
|
03/29/2007
| | | | |
Title:
|
METHOD AND SYSTEM OF TRACE PULL TEST
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2007
|
Application #:
|
11301303
|
Filing Dt:
|
12/12/2005
|
Publication #:
|
|
Pub Dt:
|
05/04/2006
| | | | |
Title:
|
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2009
|
Application #:
|
11456141
|
Filing Dt:
|
07/07/2006
|
Publication #:
|
|
Pub Dt:
|
10/19/2006
| | | | |
Title:
|
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/08/2011
|
Application #:
|
11475131
|
Filing Dt:
|
06/27/2006
|
Publication #:
|
|
Pub Dt:
|
12/27/2007
| | | | |
Title:
|
3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2009
|
Application #:
|
11488653
|
Filing Dt:
|
07/19/2006
|
Publication #:
|
|
Pub Dt:
|
01/24/2008
| | | | |
Title:
|
STRUCTURE OF IMAGE SENSOR MODULE AND A METHOD FOR MANUFACTURING OF WAFER LEVEL PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2008
|
Application #:
|
11538098
|
Filing Dt:
|
10/03/2006
|
Publication #:
|
|
Pub Dt:
|
04/12/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PROTECTIVE STRUCTURE AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2008
|
Application #:
|
11567795
|
Filing Dt:
|
12/07/2006
|
Publication #:
|
|
Pub Dt:
|
06/12/2008
| | | | |
Title:
|
STRUCTURE AND PROCESS FOR WL-CSP WITH METAL COVER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2009
|
Application #:
|
11608254
|
Filing Dt:
|
12/08/2006
|
Publication #:
|
|
Pub Dt:
|
06/12/2008
| | | | |
Title:
|
IMAGE SENSOR MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2008
|
Application #:
|
11647217
|
Filing Dt:
|
12/29/2006
|
Publication #:
|
|
Pub Dt:
|
07/03/2008
| | | | |
Title:
|
SEMICONDUCTOR IMAGE DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2011
|
Application #:
|
11647448
|
Filing Dt:
|
12/29/2006
|
Publication #:
|
|
Pub Dt:
|
07/03/2008
| | | | |
Title:
|
RF MODULE PACKAGE FOR RELEASING STRESS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2012
|
Application #:
|
11648688
|
Filing Dt:
|
01/03/2007
|
Publication #:
|
|
Pub Dt:
|
07/03/2008
| | | | |
Title:
|
WAFER LEVEL PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/12/2010
|
Application #:
|
11648787
|
Filing Dt:
|
01/03/2007
|
Publication #:
|
|
Pub Dt:
|
07/03/2008
| | | | |
Title:
|
WAFER LEVEL PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/06/2012
|
Application #:
|
11692933
|
Filing Dt:
|
03/29/2007
|
Publication #:
|
|
Pub Dt:
|
10/02/2008
| | | | |
Title:
|
CHIP PACKAGING STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2012
|
Application #:
|
11694719
|
Filing Dt:
|
03/30/2007
|
Publication #:
|
|
Pub Dt:
|
10/02/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2009
|
Application #:
|
11725041
|
Filing Dt:
|
03/15/2007
|
Publication #:
|
|
Pub Dt:
|
09/18/2008
| | | | |
Title:
|
IMAGE SENSOR MODULE HAVING BUILD-IN PACKAGE CAVITY AND THE METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/28/2009
|
Application #:
|
11725827
|
Filing Dt:
|
03/19/2007
|
Publication #:
|
|
Pub Dt:
|
09/25/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PACKAGE HAVING MULTI-CHIPS WITH SIDE-BY-SIDE CONFIGURATION AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2008
|
Application #:
|
11747417
|
Filing Dt:
|
05/11/2007
|
Publication #:
|
|
Pub Dt:
|
09/06/2007
| | | | |
Title:
|
CHIP-SIZE PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/13/2009
|
Application #:
|
11799923
|
Filing Dt:
|
05/03/2007
|
Publication #:
|
|
Pub Dt:
|
02/21/2008
| | | | |
Title:
|
METHOD FOR FORMING FILLING PASTE STRUCTURE OF WL PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/30/2010
|
Application #:
|
11933758
|
Filing Dt:
|
11/01/2007
|
Publication #:
|
|
Pub Dt:
|
02/12/2009
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/10/2009
|
Application #:
|
11945723
|
Filing Dt:
|
11/27/2007
|
Publication #:
|
|
Pub Dt:
|
05/08/2008
| | | | |
Title:
|
STRUCTURE OF IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING OF WAFER LEVEL PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2009
|
Application #:
|
11946424
|
Filing Dt:
|
11/28/2007
|
Publication #:
|
|
Pub Dt:
|
05/08/2008
| | | | |
Title:
|
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2008
|
Application #:
|
11954087
|
Filing Dt:
|
12/11/2007
|
Publication #:
|
|
Pub Dt:
|
07/03/2008
| | | | |
Title:
|
SENSOR MODULE PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2010
|
Application #:
|
12141138
|
Filing Dt:
|
06/18/2008
|
Publication #:
|
|
Pub Dt:
|
10/09/2008
| | | | |
Title:
|
WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/27/2010
|
Application #:
|
12216658
|
Filing Dt:
|
07/09/2008
|
Publication #:
|
|
Pub Dt:
|
11/06/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PACKAGE WITH MULTI-CHIPS AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/08/2011
|
Application #:
|
12217086
|
Filing Dt:
|
06/30/2008
|
Publication #:
|
|
Pub Dt:
|
12/31/2009
| | | | |
Title:
|
SYSTEM-IN-PACKAGE AND MANUFACTURING METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/23/2010
|
Application #:
|
12255868
|
Filing Dt:
|
10/22/2008
|
Publication #:
|
|
Pub Dt:
|
02/26/2009
| | | | |
Title:
|
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2013
|
Application #:
|
12975698
|
Filing Dt:
|
12/22/2010
|
Publication #:
|
|
Pub Dt:
|
06/28/2012
| | | | |
Title:
|
THREE-DIMENSIONAL SYSTEM-IN-PACKAGE PACKAGE-ON-PACKAGE STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2012
|
Application #:
|
13010192
|
Filing Dt:
|
01/20/2011
|
Publication #:
|
|
Pub Dt:
|
07/26/2012
| | | | |
Title:
|
INJECTION MOLDING SYSTEM AND METHOD OF CHIP PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/28/2014
|
Application #:
|
13311287
|
Filing Dt:
|
12/05/2011
|
Publication #:
|
|
Pub Dt:
|
03/29/2012
| | | | |
Title:
|
CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/21/2017
|
Application #:
|
14562566
|
Filing Dt:
|
12/05/2014
|
Publication #:
|
|
Pub Dt:
|
06/11/2015
| | | | |
Title:
|
ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHOD OF MANUFACTURING PACKAGE CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2018
|
Application #:
|
15424878
|
Filing Dt:
|
02/05/2017
|
Publication #:
|
|
Pub Dt:
|
06/15/2017
| | | | |
Title:
|
ELECTRONIC PACKAGE HAVING A SUPPORTING BOARD AND PACKAGE CARRIER THEREOF
|
|