Patent Assignment Details
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| Reel/Frame: | 013334/0662 | |
| Pages: | 4 |
| | Recorded: | 09/26/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/11/2003
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Application #:
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10254799
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Filing Dt:
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09/26/2002
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Title:
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ETCHING BACK PROCESS TO IMPROVE TOPOGRAPHIC PLANARIZATION OF A POLYSILICON LAYER
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Assignee
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| 123, PARK AVE-3RD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 30077, R.O.C. |
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Correspondence name and address
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INTELLECTUAL PROPERTY SOLUTIONS, P.L.L.C
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RAYMOND J. HO
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1300 PENNSYLVANIA AVE., N.W.
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STE. 700
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WASHINGTON, DC 20004
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