Patent Assignment Details
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| Reel/Frame: | 015467/0662 | |
| Pages: | 4 |
| | Recorded: | 06/11/2004 | | |
| Attorney Dkt #: | BDG032 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10866393
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Filing Dt:
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06/11/2004
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH PRESS-FIT GROUND PLANE
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Assignee
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| 3RD FLOOR, 157 LI-TE ROAD |
| PEITOU DISTRICT |
| TAIPEI, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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2440 ANDREW DRIVE
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SUPERIOR, CO 80027
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