Patent Assignment Details
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Reel/Frame: | 021486/0663 | |
| Pages: | 3 |
| | Recorded: | 08/29/2008 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/07/2008
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Application #:
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11249129
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Filing Dt:
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10/12/2005
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Title:
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APPARATUS AND METHOD FOR BONDING SILICON WAFER TO CONDUCTIVE SUBSTRATE
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Assignee
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130 W. UNION ST. |
PASADENA, CALIFORNIA 91103 |
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Correspondence name and address
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ANDREW S. NAGLESTAD
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130 W. UNION ST.
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PASADENA, CALIFORNIA 91103
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