Patent Assignment Details
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| Reel/Frame: | 040383/0663 | |
| Pages: | 4 |
| | Recorded: | 11/21/2016 | | |
| Attorney Dkt #: | 104000-100 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15347253
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Filing Dt:
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11/09/2016
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Publication #:
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Pub Dt:
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05/10/2018
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Title:
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Substrate Based Fan-Out Wafer Level Packaging
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Assignee
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| UBN TOWER, 9TH FLOOR |
| NO. 10, JALAN P. RAMLEE |
| KUALA LUMPUR, MALAYSIA 50250 |
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Correspondence name and address
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ANDREW D. BOCHNER
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450 LEXINGTON AVENUE
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WIGGIN AND DANA LLP, 38TH FLOOR
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NEW YORK, NY 10017
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