Patent Assignment Details
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| Reel/Frame: | 054767/0664 | |
| Pages: | 5 |
| | Recorded: | 12/29/2020 | | |
| Attorney Dkt #: | 1012-2882 / 2019P55561 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/31/2023
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Application #:
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17108079
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Filing Dt:
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12/01/2020
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Publication #:
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Pub Dt:
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06/10/2021
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Title:
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Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip
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Assignee
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA 9500 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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SUITE 200
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CARY, NC 27518
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