Patent Assignment Details
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Reel/Frame: | 004200/0668 | |
| Pages: | 2 |
| | Recorded: | 11/25/1983 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/08/1985
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Application #:
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06555264
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Filing Dt:
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11/25/1983
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Title:
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METHOD FOR FORMING ELONGATED SOLDER CONNECTIONS BETWEEN A SEMICONDUCTOR DEVICE AND A SUPPORTING SUBSTRATE
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Correspondence name and address
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WOLMAR J. STOFFEL
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DEPT. 901, BLDG. 300/482, IBM CORP.
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HOPEWELL JUNCTION, NY 12533
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