Patent Assignment Details
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| Reel/Frame: | 007498/0672 | |
| Pages: | 3 |
| | Recorded: | 05/25/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/22/1997
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Application #:
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08450307
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Filing Dt:
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05/25/1995
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Title:
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ETCHING METHOD USING NH4F SOLUTION TO MAKE SURFACE OF SILICON SMOOTH IN ATOMIC ORDER
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Assignees
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| 1-8 HON-CHO, 4-CHOME, KAWAGUCHI-SHI |
| SAITAMA-KEN, JAPAN 332 |
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| 1-9-16 YAGIYAMA-MINAMI TAIHAKU-KU, SENDAI-SHI |
| MIYAGI-KEN, JAPAN 982 |
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| 2-18-13 YAGIYAMA-HIGASHI, TAIHAKU-KU, SENDAI-SHI |
| MIYAGI-KEN, JAPAN 932 |
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Correspondence name and address
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RUSSELL D. ORKIN
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WEBB, ZIESENHEIM, BRUENING, ET AL.
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700 KOPPERS BUILDING
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436 SEVENTH AVENUE
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PITTSBURGH, PA 15219
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