Patent Assignment Details
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Reel/Frame: | 011800/0672 | |
| Pages: | 3 |
| | Recorded: | 05/14/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/10/2003
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Application #:
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09724727
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Filing Dt:
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11/28/2000
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Title:
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LOCKING OF MOLD COMPOUND TO CONDUCTIVE SUBSTRATE PANELS
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Assignee
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER, WEAVER & THOMAS, LLP
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PHILLIP P. LEE
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P.O. BOX 778
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BERKELE, CA 94704-0778
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