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Patent #:
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Issue Dt:
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09/09/2014
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Application #:
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11098995
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Filing Dt:
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04/05/2005
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Title:
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Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
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Patent #:
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Issue Dt:
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10/11/2016
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Application #:
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11677506
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Filing Dt:
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02/21/2007
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Title:
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Semiconductor Package in Package
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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11681121
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Filing Dt:
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03/01/2007
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Title:
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HIGH DENSITY MEMORY CARD USING FOLDED FLEX
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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12183778
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Filing Dt:
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07/31/2008
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Title:
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STACKED INVERTED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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03/25/2014
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Application #:
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12348853
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Filing Dt:
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01/05/2009
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Title:
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LEADFRAME STRUCTURE FOR CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE
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Patent #:
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Issue Dt:
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10/28/2014
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Application #:
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12351596
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Filing Dt:
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01/09/2009
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Title:
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EXTENDED LANDING PAD SUBSTRATE PACKAGE STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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11/05/2013
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Application #:
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12419180
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Filing Dt:
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04/06/2009
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME INCLUDING POWER BARS
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Patent #:
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Issue Dt:
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01/07/2014
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Application #:
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12474009
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Filing Dt:
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05/28/2009
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Title:
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STACKABLE PROTRUDING VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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12481512
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Filing Dt:
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06/09/2009
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Title:
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FRAME INTERCONNECT FOR CONCENTRATED PHOTOVOLTAIC MODULE
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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12568041
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Filing Dt:
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09/28/2009
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Title:
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ROUTABLE SINGLE LAYER SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
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Patent #:
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Issue Dt:
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08/05/2014
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Application #:
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12573466
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Filing Dt:
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10/05/2009
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Title:
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FAN OUT BUILD UP SUBSTRATE STACKABLE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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09/23/2014
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Application #:
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12577064
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Filing Dt:
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10/09/2009
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Title:
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CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE WITH BUILT-IN CONNECTOR
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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12626512
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Filing Dt:
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11/25/2009
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Title:
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THROUGH WAFER VIA STRUCTURES FOR CONCENTRATED PHOTOVOLTAIC CELLS
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Patent #:
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Issue Dt:
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01/20/2015
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Application #:
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12630586
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Filing Dt:
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12/03/2009
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Title:
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THIN STACKABLE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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06/27/2017
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Application #:
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12632170
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Filing Dt:
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12/07/2009
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Title:
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METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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12690741
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Filing Dt:
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01/20/2010
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Title:
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TRACE STACKING STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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12/10/2013
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Application #:
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12708432
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Filing Dt:
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02/18/2010
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Title:
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SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS TO PREVENT SOLDER REFLOW
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Patent #:
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Issue Dt:
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12/31/2013
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Application #:
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12727608
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Filing Dt:
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03/19/2010
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Title:
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SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
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10/22/2013
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Application #:
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12730062
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Filing Dt:
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03/23/2010
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Title:
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SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW FRAME FOR HEAT SINK ATTACHMENT
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Patent #:
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Issue Dt:
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02/03/2015
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Application #:
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12779784
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Filing Dt:
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05/13/2010
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Title:
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SHIELDED ELECTRONIC COMPONENT PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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12800757
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Filing Dt:
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05/21/2010
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Title:
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BLIND VIA CAPTURE PAD STRUCTURE FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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12815260
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Filing Dt:
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06/14/2010
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Title:
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CONCENTRATED PHOTOVOLTAIC RECEIVER MODULE WITH IMPROVED OPTICAL LIGHT GUIDE ASSEMBLY
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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12830138
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Filing Dt:
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07/02/2010
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Title:
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MOLDED LIGHT GUIDE FOR CONCENTRATED PHOTOVOLTAIC RECEIVER MODULE
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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12834682
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Filing Dt:
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07/12/2010
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Title:
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TOP PORT MEMS MICROPHONE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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12848833
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Filing Dt:
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08/02/2010
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Title:
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FINGERPRINT SENSOR PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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12881905
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Filing Dt:
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09/14/2010
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Title:
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CONDUCTIVE PASTE AND MOLD FOR ELECTRICAL CONNECTION OF PHOTOVOLTAIC DIE TO SUBSTRATE
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Patent #:
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Issue Dt:
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03/03/2015
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Application #:
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12913376
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Filing Dt:
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10/27/2010
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Title:
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LOW STRESS SUBSTRATE AND FORMATION METHOD
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Patent #:
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Issue Dt:
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06/16/2015
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Application #:
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12924918
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Filing Dt:
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10/08/2010
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Title:
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SHIELDED TRACE STRUCTURE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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08/29/2017
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Application #:
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12939588
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Filing Dt:
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11/04/2010
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Title:
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WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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12/10/2013
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Application #:
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12945464
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Filing Dt:
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11/12/2010
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Title:
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ELECTRONIC ASSEMBLY HAVING INCREASED STANDOFF HEIGHT
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Patent #:
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Issue Dt:
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11/04/2014
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Application #:
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12955509
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Filing Dt:
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11/29/2010
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Publication #:
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Pub Dt:
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05/31/2012
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Title:
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MAGNETIC FIELD SIMULATOR FOR TESTING SINGULATED OR MULTI-SITE STRIP SEMICONDUCTOR DEVICE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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07/29/2014
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Application #:
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12959851
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Filing Dt:
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12/03/2010
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Title:
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INTEGRATED PASSIVE DEVICE STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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10/15/2013
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Application #:
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12959911
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Filing Dt:
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12/03/2010
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Title:
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SEMICONDUCTOR DEVICE HAVING OVERLAPPED VIA APERTURES
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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12963431
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Filing Dt:
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12/08/2010
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH DOWNSETS
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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12968794
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Filing Dt:
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12/15/2010
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Publication #:
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Pub Dt:
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04/07/2011
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Title:
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WAFERS INCLUDING PATTERNED BACK SIDE LAYERS THEREON
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Patent #:
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Issue Dt:
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02/11/2014
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Application #:
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13015071
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Filing Dt:
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01/27/2011
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS
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Patent #:
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Issue Dt:
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10/13/2015
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Application #:
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13015445
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Filing Dt:
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01/27/2011
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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12/31/2013
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Application #:
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13016343
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Filing Dt:
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01/28/2011
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Title:
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TOP PORT WITH INTERPOSER MEMS MICROPHONE PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13034517
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Filing Dt:
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02/24/2011
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Title:
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SEMICONDUCTOR DEVICE WITH MICRO ELECTROMECHANICAL SYSTEM DIE
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Patent #:
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Issue Dt:
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04/21/2015
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Application #:
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13046071
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Filing Dt:
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03/11/2011
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Title:
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STACKED AND STAGGERED DIE MEMS PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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13094728
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Filing Dt:
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04/26/2011
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Title:
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Semiconductor Package with Patterning layer and Method of Making Same
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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13099680
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Filing Dt:
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05/03/2011
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Title:
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CONFORMAL SHIELD ON PUNCH QFN SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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10/23/2018
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Application #:
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13169385
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Filing Dt:
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06/27/2011
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Title:
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INTEGRATED SHIELD PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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09/02/2014
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Application #:
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13181248
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Filing Dt:
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07/12/2011
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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13233606
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Filing Dt:
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09/15/2011
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Title:
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ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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01/21/2014
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Application #:
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13236916
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Filing Dt:
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09/20/2011
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Title:
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UNDERFILL CONTACTING STACKING BALLS PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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10/15/2013
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Application #:
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13246564
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Filing Dt:
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09/27/2011
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Title:
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PACKAGE IN PACKAGE DEVICE FOR RF TRANSCEIVER MODULE
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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13270000
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Filing Dt:
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10/10/2011
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O CONFIGURATION
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Patent #:
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05/12/2015
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Application #:
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13272096
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Filing Dt:
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10/12/2011
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Title:
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MOLDED CAVITY SUBSTRATE MEMS PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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09/01/2015
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Application #:
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13274877
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Filing Dt:
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10/17/2011
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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09/09/2014
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Application #:
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13286903
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Filing Dt:
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11/01/2011
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE AND METHOD OF FABRICATING WAFER LEVEL CHIP SCALE PACKAGE
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13302501
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Filing Dt:
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11/22/2011
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Title:
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WAFER LEVEL FAN OUT PACKAGE
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Patent #:
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Issue Dt:
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10/08/2013
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13306685
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Filing Dt:
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11/29/2011
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Title:
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CONDUCTIVE PAD ON PROTRUDING THROUGH ELECTRODE SEMICONDUCTOR DEVICE
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10/08/2013
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13327440
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Filing Dt:
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12/15/2011
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Title:
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ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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03/17/2015
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13348304
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01/11/2012
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Publication #:
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05/03/2012
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Title:
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REVERSIBLE TOP/BOTTOM MEMS PACKAGE
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03/31/2015
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13350619
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01/13/2012
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Publication #:
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Pub Dt:
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05/10/2012
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Title:
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MOLDED IMAGE SENSOR PACKAGE AND METHOD
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10/06/2015
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Application #:
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13356330
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Filing Dt:
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01/23/2012
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Title:
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SHIELDING TECHNIQUE FOR SEMICONDUCTOR PACKAGE INCLUDING METAL LID AND METALIZED CONTACT AREA
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06/07/2016
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13356349
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01/23/2012
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Title:
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SHIELDING TECHNIQUE FOR SEMICONDUCTOR PACKAGE INCLUDING METAL LID
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08/01/2017
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13398646
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02/16/2012
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Title:
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METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES
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03/17/2015
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13399321
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02/17/2012
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Title:
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ELECTRONIC COMPONENT PACKAGE HAVING BLEED CHANNEL STRUCTURE AND METHOD
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07/11/2017
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13412848
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03/06/2012
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SEMICONDUCTOR DEVICE WITH LEADFRAME CONFIGURED TO FACILITATE REDUCED BURR FORMATION
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08/02/2016
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13420188
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03/14/2012
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Pub Dt:
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10/11/2012
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Title:
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PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
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09/08/2015
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13434181
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Filing Dt:
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03/29/2012
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Title:
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EMBEDDED COMPONENT PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/02/2015
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Application #:
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13434217
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03/29/2012
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Title:
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BACKSIDE WARPAGE CONTROL STRUCTURE AND FABRICATION METHOD
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Patent #:
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03/04/2014
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Application #:
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13447650
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Filing Dt:
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04/16/2012
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Title:
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ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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03/24/2015
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Application #:
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13452006
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Filing Dt:
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04/20/2012
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Title:
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WARPAGE CONTROL STIFFENER RING PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/23/2015
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Application #:
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13454881
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Filing Dt:
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04/24/2012
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Title:
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INTEGRATED CIRCUIT WITH EFFICIENT MEMS ARCHITECTURE
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11/18/2014
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13455539
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Filing Dt:
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04/25/2012
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Publication #:
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Pub Dt:
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11/01/2012
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Title:
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SEMICONDUCTOR DEVICE
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07/22/2014
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13458353
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Filing Dt:
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04/27/2012
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Title:
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ELECTRICAL CIRCUIT WITH COMPONENT-ACCOMMODATING LID
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05/05/2015
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13459661
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Filing Dt:
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04/30/2012
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Title:
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WIRE FENCE FINGERPRINT SENSOR PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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10/18/2016
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Application #:
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13466717
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Filing Dt:
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05/08/2012
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Publication #:
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Pub Dt:
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11/29/2012
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Title:
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LEAD FRAME FOR SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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08/30/2016
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Application #:
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13475469
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Filing Dt:
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05/18/2012
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Title:
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SHIELD LID INTERCONNECT PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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01/21/2014
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Application #:
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13479829
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Filing Dt:
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05/24/2012
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Title:
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IC PACKAGE WITH INTEGRATED ELECTROSTATIC DISCHARGE PROTECTION
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Patent #:
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Issue Dt:
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01/14/2014
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Application #:
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13487705
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Filing Dt:
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06/04/2012
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Title:
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STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
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Patent #:
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Issue Dt:
|
04/22/2014
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Application #:
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13528206
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Filing Dt:
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06/20/2012
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Title:
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STACKABLE VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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01/27/2015
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Application #:
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13546870
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Filing Dt:
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07/11/2012
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Title:
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DIE SEAL DESIGN AND METHOD AND APPARATUS FOR INTEGRATED CIRCUIT PRODUCTION
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Patent #:
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Issue Dt:
|
12/16/2014
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Application #:
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13564567
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Filing Dt:
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08/01/2012
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Title:
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DESIGN AND METHOD FOR CONTROLLING MOLDING COMPOUND GEOMETRY AROUND A SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
|
04/28/2015
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Application #:
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13566082
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Filing Dt:
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08/03/2012
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Publication #:
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Pub Dt:
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02/14/2013
| | | | |
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Title:
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SEMICONDUCTOR DEVICE
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|
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Patent #:
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Issue Dt:
|
05/31/2016
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Application #:
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13596322
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Filing Dt:
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08/28/2012
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Publication #:
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Pub Dt:
|
02/14/2013
| | | | |
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Title:
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SEMICONDUCTOR DEVICE
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|
|
|
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Patent #:
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Issue Dt:
|
02/03/2015
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Application #:
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13603039
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Filing Dt:
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09/04/2012
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Title:
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MUSHROOM SHAPED BUMP ON REPASSIVATION
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|
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Patent #:
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Issue Dt:
|
01/27/2015
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Application #:
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13608521
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Filing Dt:
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09/10/2012
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Title:
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PROCESSING SOLDERBRACE USING LIGHT WAVELENGTH FILTER AND A BROADBAND LIGHT SOURCE (As amended)
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Patent #:
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Issue Dt:
|
05/26/2015
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Application #:
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13608544
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Filing Dt:
|
09/10/2012
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|
Title:
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MERGED FIDUCIAL FOR SEMICONDUCTOR CHIP PACKAGES
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|
|
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Patent #:
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Issue Dt:
|
02/23/2016
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Application #:
|
13614631
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Filing Dt:
|
09/13/2012
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|
Title:
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MOLDED ELECTRONIC PACKAGE GEOMETRY TO CONTROL WARPAGE AND DIE STRESS
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|
|
|
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Patent #:
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|
Issue Dt:
|
05/24/2016
|
Application #:
|
13614648
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Filing Dt:
|
09/13/2012
|
|
Title:
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Electronic Package With Embedded Materials in a Molded Structure to Control Warpage and Stress
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|
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Patent #:
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|
Issue Dt:
|
10/07/2014
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Application #:
|
13662702
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Filing Dt:
|
10/29/2012
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
05/10/2016
|
Application #:
|
13663001
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Filing Dt:
|
10/29/2012
|
|
Title:
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METHOD AND SYSTEM FOR SOLDER SHIELDING OF BALL GRID ARRAYS
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Patent #:
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Issue Dt:
|
04/26/2016
|
Application #:
|
13663208
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Filing Dt:
|
10/29/2012
|
|
Title:
|
THROUGH VIA NUB REVEAL METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
|
08/05/2014
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Application #:
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13678012
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Filing Dt:
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11/15/2012
|
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Publication #:
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Pub Dt:
|
05/15/2014
| | | | |
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Title:
|
Method And System For A Semiconductor Device Package With A Die-To-Die First Bond
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Patent #:
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Issue Dt:
|
08/12/2014
|
Application #:
|
13678026
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Filing Dt:
|
11/15/2012
|
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Publication #:
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Pub Dt:
|
05/15/2014
| | | | |
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Title:
|
METHODS FOR TEMPORARY WAFER MOLDING FOR CHIP-ON-WAFER ASSEMBLY
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Patent #:
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Issue Dt:
|
05/26/2015
|
Application #:
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13678046
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Filing Dt:
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11/15/2012
|
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Publication #:
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Pub Dt:
|
05/15/2014
| | | | |
|
Title:
|
Method And System For A Semiconductor Device Package With A Die To Interposer Wafer First Bond
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Patent #:
|
|
Issue Dt:
|
09/15/2015
|
Application #:
|
13678058
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Filing Dt:
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11/15/2012
|
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Publication #:
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Pub Dt:
|
05/15/2014
| | | | |
|
Title:
|
METHOD AND SYSTEM FOR A SEMICONDUCTOR FOR DEVICE PACKAGE WITH A DIE-TO-PACKAGING SUBSTRATE FIRST BOND
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|
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Patent #:
|
|
Issue Dt:
|
06/27/2017
|
Application #:
|
13679627
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Filing Dt:
|
11/16/2012
|
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Title:
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BUILDUP DIELECTRIC LAYER HAVING METALLIZATION PATTERN SEMICONDUCTOR PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
|
06/17/2014
|
Application #:
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13680687
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Filing Dt:
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11/19/2012
|
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Title:
|
MECHANICAL TAPE SEPARATION PACKAGE
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Patent #:
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Issue Dt:
|
03/24/2015
|
Application #:
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13690817
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Filing Dt:
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11/30/2012
|
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Title:
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Method And System For Backside Dielectric Patterning For Wafer Warpage And Stress Control
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Patent #:
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Issue Dt:
|
03/17/2015
|
Application #:
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13725645
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Filing Dt:
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12/21/2012
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Publication #:
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Pub Dt:
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08/22/2013
| | | | |
|
Title:
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SEMICONDUCTOR PACKAGE WITH ALTERNATING THERMAL INTERFACE AND ADHESIVE MATERIALS AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
04/07/2015
|
Application #:
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13726917
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Filing Dt:
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12/26/2012
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Publication #:
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Pub Dt:
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05/15/2014
| | | | |
|
Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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|
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Patent #:
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Issue Dt:
|
10/08/2013
|
Application #:
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13737325
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Filing Dt:
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01/09/2013
|
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Title:
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SHIELDED PACKAGE HAVING SHIELD LID
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Patent #:
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Issue Dt:
|
12/20/2016
|
Application #:
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13738669
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Filing Dt:
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01/10/2013
|
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
|
09/09/2014
|
Application #:
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13739547
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Filing Dt:
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01/11/2013
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Publication #:
|
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Pub Dt:
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12/12/2013
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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|
Issue Dt:
|
04/28/2015
|
Application #:
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13739565
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Filing Dt:
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01/11/2013
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Publication #:
|
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Pub Dt:
|
06/20/2013
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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