Total properties:
32
|
|
Patent #:
|
|
Issue Dt:
|
02/26/1985
|
Application #:
|
06490098
|
Filing Dt:
|
04/29/1983
|
Title:
|
FLAME RETARDANT B-STAGED EPOXY RESIN PREPREGS AND LAMINATES MADE THEREFROM
|
|
|
Patent #:
|
|
Issue Dt:
|
05/12/1987
|
Application #:
|
06871337
|
Filing Dt:
|
06/06/1986
|
Title:
|
HOMOGENEOUS THERMOSET COPOLYMER FROM POLY (VINYL BENZYL ETHER) AND DICYANATE ESTER
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/1989
|
Application #:
|
06871965
|
Filing Dt:
|
06/09/1986
|
Title:
|
HOMOGENEOUS THERMOSET COPOLYMERS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/1988
|
Application #:
|
06888292
|
Filing Dt:
|
07/22/1986
|
Title:
|
METHOD OF CONTINUOUSLY VACUUM IMPREGNATING FIBROUS SHEET MATERIAL
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/1988
|
Application #:
|
07073610
|
Filing Dt:
|
07/15/1987
|
Title:
|
CONTROLLED DEPTH LASER DRILLING SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
08/25/1992
|
Application #:
|
07598512
|
Filing Dt:
|
10/16/1990
|
Title:
|
METHOD FOR MEASURING DEGREE OF CURE OF RESIN IN A COMPOSITE MATERIAL AND PROCESS FOR MAKING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/03/1992
|
Application #:
|
07685337
|
Filing Dt:
|
04/15/1991
|
Title:
|
SYSTEM AND METHOD FOR MANUFACTURING COPPER CLAD GLASS EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/27/1994
|
Application #:
|
07982797
|
Filing Dt:
|
11/30/1992
|
Title:
|
SYSTEM OF ELECTRONIC LAMINATES WITH IMPROVED REGISTRATION PROPERTIES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/1994
|
Application #:
|
07993147
|
Filing Dt:
|
12/18/1992
|
Title:
|
POLYIMIDE RESIN LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/30/1996
|
Application #:
|
08126478
|
Filing Dt:
|
09/24/1993
|
Title:
|
COPPER FOIL LAMINATE FOR PROTECTING MULTILAYER ARTICLES
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/1995
|
Application #:
|
08153401
|
Filing Dt:
|
11/16/1993
|
Title:
|
SUBSTITUTED CYANOGUANIDINES AS CURING AGENTS FOR EPOXY RESINS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/1995
|
Application #:
|
08239072
|
Filing Dt:
|
05/06/1994
|
Title:
|
PROCESS FOR MEASUREMENT OF THE DEGREE OF CURE AND PERCENT RESIN OF GLASS-FIBER-REINFORCED EPOXY RESIN PREPREG
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/1995
|
Application #:
|
08246054
|
Filing Dt:
|
05/19/1994
|
Title:
|
SYSTEM OF ELECTRONIC LAMINATES WITH IMPROVED REGISTRATION PROPERTIES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/16/1996
|
Application #:
|
08340962
|
Filing Dt:
|
11/17/1994
|
Title:
|
CURING EPOXY RESINS USING DICY, IMIDAZOLE AND ACID
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2009
|
Application #:
|
08540429
|
Filing Dt:
|
10/10/1995
|
Title:
|
REDUCING DUSTING OF EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/1997
|
Application #:
|
08570260
|
Filing Dt:
|
12/11/1995
|
Title:
|
SOLDER MASK FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/13/2001
|
Application #:
|
08620525
|
Filing Dt:
|
03/22/1996
|
Title:
|
FILLERS FOR IMPROVED EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2001
|
Application #:
|
09024997
|
Filing Dt:
|
02/17/1998
|
Title:
|
POSITIVE ACTING PHOTODIELECTRIC COMPOSITION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/03/2001
|
Application #:
|
09054264
|
Filing Dt:
|
04/03/1998
|
Title:
|
FABRICATION OF HIGH DENSITY MULTILAYER INTERCONNECT PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2001
|
Application #:
|
09123952
|
Filing Dt:
|
07/28/1998
|
Title:
|
HIGH DENSITY PRINTED CIRCUIT SUBSTRATE AND METHOD OF FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2000
|
Application #:
|
09224991
|
Filing Dt:
|
01/04/1999
|
Title:
|
METHODS OF MANUFACTURING VOIDLESS RESIN IMPREGNATED WEBS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2003
|
Application #:
|
09269014
|
Filing Dt:
|
06/14/1999
|
Publication #:
|
|
Pub Dt:
|
06/27/2002
| | | | |
Title:
|
EPOXY RESINS, STYRENE-MALEIC ANHYDRIDE COPOLYMER AND CO-CROSSLINKING AGENT
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2003
|
Application #:
|
09270303
|
Filing Dt:
|
03/15/1999
|
Title:
|
COMPENSATION MODEL AND REGISTRATION SIMULATION APPARATUS AND METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARDS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
09716067
|
Filing Dt:
|
11/17/2000
|
Title:
|
HALOGEN FREE FLAME RETARDANT ADHESIVE RESIN COATED COMPOSITE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2001
|
Application #:
|
09735984
|
Filing Dt:
|
12/13/2000
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
Title:
|
TALC PARTICLES AS FILLERS FOR IMPROVED EPOXY LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/15/2006
|
Application #:
|
10309720
|
Filing Dt:
|
12/04/2002
|
Publication #:
|
|
Pub Dt:
|
10/23/2003
| | | | |
Title:
|
THERMOSETTING RESIN COMPOSITION FOR HIGH PERFORMANCE LAMINATES
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10310418
|
Filing Dt:
|
12/05/2002
|
Publication #:
|
|
Pub Dt:
|
08/21/2003
| | | | |
Title:
|
EPOXY RESIN, STYRENE-MALEIC ANHYDRIDE COPOLYMER AND BISMALEIMIDE-TRIAZINE RESIN
|
|
|
Patent #:
|
|
Issue Dt:
|
08/14/2007
|
Application #:
|
10385044
|
Filing Dt:
|
03/10/2003
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
Title:
|
LAMINATE COMPOSITION
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2012
|
Application #:
|
10858344
|
Filing Dt:
|
06/01/2004
|
Publication #:
|
|
Pub Dt:
|
12/01/2005
| | | | |
Title:
|
LAMINATE COMPOSITION FOR PRODUCING REDUCED CURL FLAT THIN CORE LAMINATE
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11002045
|
Filing Dt:
|
12/03/2004
|
Publication #:
|
|
Pub Dt:
|
05/05/2005
| | | | |
Title:
|
Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent
|
|
|
Patent #:
|
|
Issue Dt:
|
09/16/2008
|
Application #:
|
11132846
|
Filing Dt:
|
05/19/2005
|
Publication #:
|
|
Pub Dt:
|
09/29/2005
| | | | |
Title:
|
THERMOSETTING RESIN COMPOSITION FOR HIGH PERFORMANCE LAMINATES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2009
|
Application #:
|
11185259
|
Filing Dt:
|
07/20/2005
|
Publication #:
|
|
Pub Dt:
|
11/10/2005
| | | | |
Title:
|
EPOXY RESIN, SMA COPOLYMER AND BIS-MALEIMIDETRIAZINE RESIN
|
|