Total properties:
40
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Patent #:
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Issue Dt:
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10/26/2004
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Application #:
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10322527
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Filing Dt:
|
12/19/2002
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Publication #:
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Pub Dt:
|
06/24/2004
| | | | |
Title:
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CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
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Patent #:
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|
Issue Dt:
|
12/07/2004
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Application #:
|
10354000
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Filing Dt:
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01/30/2003
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Publication #:
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Pub Dt:
|
08/05/2004
| | | | |
Title:
|
HIGH SPEED CIRCUIT BOARD AND METHOD FOR FABRICATION
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Patent #:
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Issue Dt:
|
06/14/2005
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Application #:
|
10370529
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Filing Dt:
|
02/24/2003
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Publication #:
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Pub Dt:
|
08/26/2004
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
|
03/29/2005
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Application #:
|
10379575
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Filing Dt:
|
03/06/2003
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Publication #:
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Pub Dt:
|
06/24/2004
| | | | |
Title:
|
INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
|
04/25/2006
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Application #:
|
10394107
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Filing Dt:
|
03/24/2003
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Publication #:
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Pub Dt:
|
08/05/2004
| | | | |
Title:
|
MULTI-CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
|
04/04/2006
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Application #:
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10394135
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Filing Dt:
|
03/24/2003
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Publication #:
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Pub Dt:
|
08/05/2004
| | | | |
Title:
|
INFORMATION HANDLING SYSTEM
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Patent #:
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|
Issue Dt:
|
10/25/2005
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Application #:
|
10409066
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Filing Dt:
|
04/09/2003
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Publication #:
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Pub Dt:
|
10/14/2004
| | | | |
Title:
|
MATERIAL SEPARATION TO FORM SEGMENTED PRODUCT
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Patent #:
|
|
Issue Dt:
|
11/09/2004
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Application #:
|
10423877
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Filing Dt:
|
04/28/2003
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Publication #:
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|
Pub Dt:
|
09/23/2004
| | | | |
Title:
|
ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
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|
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Patent #:
|
|
Issue Dt:
|
08/08/2006
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Application #:
|
10423972
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Filing Dt:
|
04/28/2003
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Publication #:
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Pub Dt:
|
09/23/2004
| | | | |
Title:
|
PINNED ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
10449019
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Filing Dt:
|
06/02/2003
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Publication #:
|
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Pub Dt:
|
12/02/2004
| | | | |
Title:
|
Electronic card
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|
|
Patent #:
|
|
Issue Dt:
|
03/21/2006
|
Application #:
|
10616932
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Filing Dt:
|
07/11/2003
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Publication #:
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|
Pub Dt:
|
01/13/2005
| | | | |
Title:
|
Method of testing spacings in pattern of openings in PCB conductive layer
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|
|
Patent #:
|
|
Issue Dt:
|
09/19/2006
|
Application #:
|
10630722
|
Filing Dt:
|
07/31/2003
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Publication #:
|
|
Pub Dt:
|
02/03/2005
| | | | |
Title:
|
ELECTRONIC COMPONENT TEST APPARATUS
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|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
10643909
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Filing Dt:
|
08/20/2003
|
Publication #:
|
|
Pub Dt:
|
02/24/2005
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2006
|
Application #:
|
10661616
|
Filing Dt:
|
09/15/2003
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
Title:
|
STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/01/2006
|
Application #:
|
10679302
|
Filing Dt:
|
10/07/2003
|
Publication #:
|
|
Pub Dt:
|
04/07/2005
| | | | |
Title:
|
METHOD OF MAKING CIRCUITIZED SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2007
|
Application #:
|
10737974
|
Filing Dt:
|
12/18/2003
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
Title:
|
Method of making multilayered printed circuit board with filled conductive holes
|
|
|
Patent #:
|
|
Issue Dt:
|
02/13/2007
|
Application #:
|
10740398
|
Filing Dt:
|
12/22/2003
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
Title:
|
PRINTED CIRCUIT BOARD WITH LOW CROSS-TALK NOISE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/21/2010
|
Application #:
|
10740500
|
Filing Dt:
|
12/22/2003
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
Title:
|
ITEM IDENTIFICATION CONTROL METHOD
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10757586
|
Filing Dt:
|
01/15/2004
|
Publication #:
|
|
Pub Dt:
|
07/21/2005
| | | | |
Title:
|
Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
|
|
|
Patent #:
|
|
Issue Dt:
|
04/24/2007
|
Application #:
|
10790747
|
Filing Dt:
|
03/03/2004
|
Publication #:
|
|
Pub Dt:
|
09/08/2005
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE WITH SIGNAL WIRE SHIELDING, ELECTRICAL ASSEMBLY UTILIZING SAME AND METHOD OF MAKING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/26/2006
|
Application #:
|
10811817
|
Filing Dt:
|
03/30/2004
|
Publication #:
|
|
Pub Dt:
|
11/25/2004
| | | | |
Title:
|
METHOD OF MAKING HIGH SPEED CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2006
|
Application #:
|
10811915
|
Filing Dt:
|
03/30/2004
|
Publication #:
|
|
Pub Dt:
|
09/16/2004
| | | | |
Title:
|
METHOD OF MAKING CIRCUITIZED SUBSTRATE ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
09/18/2007
|
Application #:
|
10812889
|
Filing Dt:
|
03/31/2004
|
Publication #:
|
|
Pub Dt:
|
10/13/2005
| | | | |
Title:
|
DIELECTRIC COMPOSITION FOR FORMING DIELECTRIC LAYER FOR USE IN CIRCUITIZED SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2006
|
Application #:
|
10812890
|
Filing Dt:
|
03/31/2004
|
Publication #:
|
|
Pub Dt:
|
10/13/2005
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/23/2009
|
Application #:
|
10860067
|
Filing Dt:
|
06/04/2004
|
Publication #:
|
|
Pub Dt:
|
12/29/2005
| | | | |
Title:
|
METHOD AND SYSTEM FOR TRACKING GOODS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/28/2006
|
Application #:
|
10860071
|
Filing Dt:
|
06/04/2004
|
Publication #:
|
|
Pub Dt:
|
12/08/2005
| | | | |
Title:
|
RADIO FREQUENCY DEVICE FOR TRACKING GOODS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10868066
|
Filing Dt:
|
06/16/2004
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
Title:
|
Electronic package with conductive pad capable of withstanding significant loads
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2007
|
Application #:
|
10882167
|
Filing Dt:
|
07/02/2004
|
Publication #:
|
|
Pub Dt:
|
01/05/2006
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2007
|
Application #:
|
10882170
|
Filing Dt:
|
07/02/2004
|
Publication #:
|
|
Pub Dt:
|
01/05/2006
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE WITH FILLED ISOLATION BORDER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2007
|
Application #:
|
10900385
|
Filing Dt:
|
07/28/2004
|
Publication #:
|
|
Pub Dt:
|
02/02/2006
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE WITH INTERNAL ORGANIC MEMORY DEVICE, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2006
|
Application #:
|
10900386
|
Filing Dt:
|
07/28/2004
|
Publication #:
|
|
Pub Dt:
|
02/02/2006
| | | | |
Title:
|
ELECTRICAL ASSEMBLY WITH INTERNAL MEMORY CIRCUITIZED SUBSTRATE HAVING ELECTRONIC COMPONENTS POSITIONED THEREON, METHOD OF MAKING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2006
|
Application #:
|
10915483
|
Filing Dt:
|
08/11/2004
|
Publication #:
|
|
Pub Dt:
|
01/20/2005
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2006
|
Application #:
|
10920235
|
Filing Dt:
|
08/18/2004
|
Publication #:
|
|
Pub Dt:
|
10/13/2005
| | | | |
Title:
|
LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRATE, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/31/2005
|
Application #:
|
10933260
|
Filing Dt:
|
09/03/2004
|
Publication #:
|
|
Pub Dt:
|
02/03/2005
| | | | |
Title:
|
INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2007
|
Application #:
|
10953923
|
Filing Dt:
|
09/29/2004
|
Publication #:
|
|
Pub Dt:
|
03/30/2006
| | | | |
Title:
|
CIRCUITIZED SUBSTRATE WITH IMPROVED IMPEDANCE CONTOL CIRCUITRY, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2006
|
Application #:
|
10955741
|
Filing Dt:
|
09/30/2004
|
Publication #:
|
|
Pub Dt:
|
02/24/2005
| | | | |
Title:
|
HIGH SPEED CIRCUITIZED SUBSTRATE WITH REDUCED THRU-HOLE STUB, METHOD FOR FABRICATION AND INFORMATION HANDLING SYSTEM UTILIZING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2006
|
Application #:
|
10968929
|
Filing Dt:
|
10/21/2004
|
Publication #:
|
|
Pub Dt:
|
05/11/2006
| | | | |
Title:
|
METHOD OF MAKING A CIRCUITIZED SUBSTRATE HAVING A PLURALITY OF SOLDER CONNECTION SITES THEREON
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2005
|
Application #:
|
10991451
|
Filing Dt:
|
11/19/2004
|
Title:
|
CIRCUITIZED SUBSTRATES UTILIZING THREE SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF, METHOD OF MAKING SAME, AND ELECTRICAL ASSEMBLIES AND INFORMATION HANDLING SYSTEMS UTILIZING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/2008
|
Application #:
|
10991532
|
Filing Dt:
|
11/19/2004
|
Publication #:
|
|
Pub Dt:
|
05/25/2006
| | | | |
Title:
|
METHOD OF MAKING CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
04/11/2006
|
Application #:
|
11031074
|
Filing Dt:
|
01/10/2005
|
Title:
|
CAPACITOR MATERIAL WITH METAL COMPONENT FOR USE IN CIRCUITIZED SUBSTRATES, CIRCUITIZED SUBSTRATE UTILIZING SAME, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
|
|