Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 064540/0676 | |
| Pages: | 10 |
| | Recorded: | 08/09/2023 | | |
| Attorney Dkt #: | 15639SS-000559-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18363995
|
Filing Dt:
|
08/02/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/04/2024
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
|
|
|
Assignee
|
|
|
|
|
| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
|
|
Correspondence name and address
|
| |
HARNESS, DICKEY & PIERCE, P.L.C.
|
| |
P.O. BOX 8910
|
| |
RESTON, VA 20195
|
Search Results as of:
11/10/2024 07:45 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
