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Reel/Frame:037321/0678   Pages: 3
Recorded: 12/17/2015
Attorney Dkt #:106915-0149
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/25/2017
Application #:
14973457
Filing Dt:
12/17/2015
Publication #:
Pub Dt:
04/14/2016
Title:
IC MODULE, DUAL IC CARD, AND METHOD FOR MANUFACTURING IC MODULE
Assignors
1
Exec Dt:
11/25/2015
2
Exec Dt:
11/25/2015
3
Exec Dt:
11/25/2015
Assignee
1
5-1, TAITO 1-CHOME
TAITO-KU, TOKYO, JAPAN 110-0016
Correspondence name and address
FOLEY & LARDNER LLP
3000 K STREET NW
SUITE 600
WASHINGTON, DC 20007

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