Patent Assignment Details
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| Reel/Frame: | 039090/0678 | |
| Pages: | 7 |
| | Recorded: | 07/07/2016 | | |
| Attorney Dkt #: | APOM096C2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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15203803
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Filing Dt:
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07/07/2016
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Publication #:
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Pub Dt:
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10/27/2016
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Title:
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Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures
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Assignee
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| 475 OAKMEAD PKWY |
| SUNNYVALE, CALIFORNIA 94085 |
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Correspondence name and address
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CHEN-CHI LIN
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1119 QUAIL CREEK CIRCLE
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SAN JOSE, CA 95120
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06/17/2024 03:00 PM
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