Patent Assignment Details
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Reel/Frame: | 009345/0679 | |
| Pages: | 3 |
| | Recorded: | 07/27/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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09122835
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Filing Dt:
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07/27/1998
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Title:
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TOPSIDE ANALYSIS OF A MULTI-LAYER INTEGRATED CIRCUIT DIE MOUNTED IN A FLIP-CHIP PACKAGE
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Assignee
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1 AMD PLACE |
SUNNYVALE, CALIFORNIA 94086 |
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Correspondence name and address
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SAWYER & ASSOCIATES
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JOSEPH A. SAWYER, JR.
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P.O. BOX 51418
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PALO ALTO, CA 94303
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