Patent Assignment Details
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Reel/Frame: | 011930/0679 | |
| Pages: | 5 |
| | Recorded: | 06/22/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/14/2003
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Application #:
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09887148
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Filing Dt:
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06/22/2001
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Title:
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UTILIZATION OF ANNEALING ENHANCED OR REPAIRED SEED LAYER TO IMPROVE COPPER INTERCONNECT RELIABILITY
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Assignee
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ONE AMD PLACE P.O. BOX 3453 |
SUNNYVALE, CALIFORNIA 94088 |
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Correspondence name and address
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RENNER, OTTO, BOISSELLE & SKLAR, LLP
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JOSEPH J. CRIMALDI
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1621 EUCLID AVENUE
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KEITH BUILDING; 19TH FLOOR
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CLEVELAND, OHIO 44115
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