Patent Assignment Details
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Reel/Frame: | 007086/0680 | |
| Pages: | 3 |
| | Recorded: | 07/14/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/02/1997
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Application #:
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08276511
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Filing Dt:
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07/14/1994
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Title:
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COMBINING TRENCH AND FIELD ISOLATION STRUCTURE FOR SEMICONDUCTOR DEVICES
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Assignee
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MAIL STOP 507 |
PATENT DEPARTMENT 2805 E. COLUMBIA ROAD |
BOISE, IDAHO 83706 |
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Correspondence name and address
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HAWLEY TROXELL ENNIS & HAWLEY
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STEVEN R. ORMISTON
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FIRST INTERSTATE CENTER
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877 MAIN STREET, SUITE 1000
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BOISE, ID 83702
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