Patent Assignment Details
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Reel/Frame: | 017242/0680 | |
| Pages: | 2 |
| | Recorded: | 11/15/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11274016
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Filing Dt:
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11/15/2005
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Publication #:
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Pub Dt:
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05/17/2007
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Title:
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Bonding pad with high bonding strength to solder ball and bump
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Assignee
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NO. 1245, JUNGHUA RD. |
SHIN-WU SHIANG |
TAOYUAN, TAIWAN |
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Correspondence name and address
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JASON Z. LIN
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SUPREME PATENT SERVICES
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POST OFFICE BOX 2339
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SARATOGA, CA 95070
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