Patent Assignment Details
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| Reel/Frame: | 045149/0680 | |
| Pages: | 6 |
| | Recorded: | 03/08/2018 | | |
| Attorney Dkt #: | 100IM0629US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/27/2019
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Application #:
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15913857
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Filing Dt:
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03/06/2018
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Publication #:
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Pub Dt:
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07/12/2018
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Title:
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METHOD OF MEASURING AN ADHESIVE FORCE OF INTERLAYER ADHESIVE LAYER IN TENSILE MODE FOR STACKED SEMICONDUCTOR DEVICE AND APPARATUS FOR MEASURING THE SAME
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Assignees
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB GYEONGGI-DO |
| ICHEON, KOREA, REPUBLIC OF 17336 |
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| 280, DAEHAK-RO, GYEONGSANGBUK-DO |
| GYEONGSAN, KOREA, REPUBLIC OF 38541 |
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Correspondence name and address
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AMPACC LAW GROUP, PLLC
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6100 219TH ST. SW
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SUITE 580
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MOUNTLAKE TERRACE, WA 98043
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06/19/2024 07:51 PM
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