Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 045602/0682 | |
| Pages: | 3 |
| | Recorded: | 04/20/2018 | | |
| Attorney Dkt #: | PS18017CYH |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2019
|
Application #:
|
15958581
|
Filing Dt:
|
04/20/2018
|
|
Publication #:
|
|
Pub Dt:
|
08/23/2018
| | | | |
|
Title:
|
CLIP-BONDED SEMICONDUCTOR CHIP PACKAGE USING METAL BUMPS AND METHOD FOR MANUFACTURING THE PACKAGE
|
|
|
Assignee
|
|
|
|
|
| (DODANG-DONG) 102, GILJU-RO 425BEON-GIL, WONMI-GU, GYEONGGI-DO |
| BUCHEON-SI, KOREA, REPUBLIC OF 14487 |
|
|
Correspondence name and address
|
| |
KORUS PATENT, LLC (ATTN: SEONG IL JEONG)
|
| |
3333 WARRENVILLE RD., SUITE 200
|
| |
LISLE, IL 60532
|
Search Results as of:
06/22/2024 10:08 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
