Patent Assignment Details
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Reel/Frame: | 005911/0683 | |
| Pages: | 3 |
| | Recorded: | 10/31/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/07/1992
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Application #:
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07785665
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Filing Dt:
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10/31/1991
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Title:
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HIGH-DENSITY ELECTRONIC PACKAGE COMPRISING STACKED SUB-MODULES WHICH ARE ELECTRICALLY INTERCONNECTERD BY SOLDER-FILLED VIAS
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Assignee
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2805 E. COLUMBIA ROAD, BOISE, ID 83706 |
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Correspondence name and address
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ANGUS C. FOX III
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MICRON TECHNOLOGY, INC.
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2805 E. COLUMBIA RD.
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BOISE, ID 83706
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