Patent Assignment Details
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| Reel/Frame: | 014460/0685 | |
| Pages: | 4 |
| | Recorded: | 09/02/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10653352
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Filing Dt:
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08/28/2003
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Publication #:
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Pub Dt:
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03/04/2004
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Title:
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High strength copper alloy and manufacturing method therefor
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Assignee
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| 2630, SHINGAI |
| IWATA-SHI, SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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DICKSTEIN, SHAPIRO, MORIN ET AL.
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STEVEN I. WEISBURD
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1177 AVENUE OF THE AMERICAS
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41ST FLOOR
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NEW YORK, NY 10036-2714
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