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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:037421/0685   Pages: 12
Recorded: 01/06/2016
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 24
1
Patent #:
6798061
Issue Dt:
09/28/2004
Application #:
09440595
Filing Dt:
11/15/1999
Publication #:
US20020079566
Pub Dt:
06/27/2002
Title:
MULTIPLE SEMICONDUCTOR CHIP (MULTI-CHIP) MODULE FOR USE IN HIGH-POWER APPLICATIONS
2
Patent #:
6552422
Issue Dt:
04/22/2003
Application #:
09649673
Filing Dt:
08/28/2000
Title:
DATA CARRIER WITH AN INTEGRATED ELECTRONIC COMPONENT AND WITH A TRANSMISSION COLL WHICH COMPRISES TURN PORTIONS ARRANGED DIRECTLY AGAINST SAID COMPONENT
3
Patent #:
6879015
Issue Dt:
04/12/2005
Application #:
09829797
Filing Dt:
04/10/2001
Publication #:
US20010045669
Pub Dt:
11/29/2001
Title:
SEMICONDUCTOR DEVICE WITH ISOLATED INTERMETAL DIELECTRICS
4
Patent #:
6649978
Issue Dt:
11/18/2003
Application #:
09884223
Filing Dt:
06/19/2001
Publication #:
US20020190317
Pub Dt:
12/19/2002
Title:
SEMICONDUCTOR MODULE HAVING MULTIPLE SEMICONDUCTOR CHIPS
5
Patent #:
6680545
Issue Dt:
01/20/2004
Application #:
09915677
Filing Dt:
07/26/2001
Publication #:
US20020036355
Pub Dt:
03/28/2002
Title:
SEMICONDUCTOR DEVICES
6
Patent #:
6643142
Issue Dt:
11/04/2003
Application #:
09973317
Filing Dt:
10/09/2001
Publication #:
US20020075663
Pub Dt:
06/20/2002
Title:
MODULE HAVING A LEAD FRAME EQUIPPED WITH COMPONENTS ON BOTH SIDES
7
Patent #:
6777963
Issue Dt:
08/17/2004
Application #:
10005689
Filing Dt:
11/08/2001
Publication #:
US20030085722
Pub Dt:
05/08/2003
Title:
CHIP-MOUNTED CONTACT SPRINGS
8
Patent #:
6617697
Issue Dt:
09/09/2003
Application #:
10015720
Filing Dt:
11/30/2001
Publication #:
US20020084517
Pub Dt:
07/04/2002
Title:
ASSEMBLY WITH CONNECTING STRUCTURE
9
Patent #:
6853944
Issue Dt:
02/08/2005
Application #:
10282450
Filing Dt:
10/29/2002
Publication #:
US20040083075
Pub Dt:
04/29/2004
Title:
JUNCTION TEMPERATURES MEASUREMENTS IN SEMICONDUCTOR CHIP PACKAGE TECHNOLOGY
10
Patent #:
6919643
Issue Dt:
07/19/2005
Application #:
10301200
Filing Dt:
11/21/2002
Publication #:
US20030098468
Pub Dt:
05/29/2003
Title:
MULTI-CHIP MODULE SEMICONDUCTOR DEVICES
11
Patent #:
7029948
Issue Dt:
04/18/2006
Application #:
10492120
Filing Dt:
10/11/2004
Publication #:
US20050064628
Pub Dt:
03/24/2005
Title:
ELECTRICAL OR ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME
12
Patent #:
7340872
Issue Dt:
03/11/2008
Application #:
10497644
Filing Dt:
06/04/2004
Publication #:
US20050035025
Pub Dt:
02/17/2005
Title:
METHOD OF AND DEVICE FOR PACKAGING ELECTRONIC COMPONENTS THUS PACKAGED
13
Patent #:
7018248
Issue Dt:
03/28/2006
Application #:
10504752
Filing Dt:
08/17/2004
Publication #:
US20050118893
Pub Dt:
06/02/2005
Title:
DEVICE FOR FORMING CONNECTION ELEMENTS
14
Patent #:
7413108
Issue Dt:
08/19/2008
Application #:
10525594
Filing Dt:
02/25/2005
Publication #:
US20050258215
Pub Dt:
11/24/2005
Title:
WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDING TOOL
15
Patent #:
7196409
Issue Dt:
03/27/2007
Application #:
10548297
Filing Dt:
09/06/2005
Publication #:
US20060202327
Pub Dt:
09/14/2006
Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR BODY AND METHOD OF MANUFACTURING THEREOF
16
Patent #:
7253532
Issue Dt:
08/07/2007
Application #:
11351746
Filing Dt:
02/10/2006
Publication #:
US20060128062
Pub Dt:
06/15/2006
Title:
ELECTRICAL OR ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME
17
Patent #:
7545026
Issue Dt:
06/09/2009
Application #:
11632518
Filing Dt:
11/05/2007
Publication #:
US20080191361
Pub Dt:
08/14/2008
Title:
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT
18
Patent #:
7750436
Issue Dt:
07/06/2010
Application #:
11632887
Filing Dt:
05/15/2008
Publication #:
US20090014831
Pub Dt:
01/15/2009
Title:
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT AND A CAPACITANCE ELEMENT
19
Patent #:
7804165
Issue Dt:
09/28/2010
Application #:
11913585
Filing Dt:
10/24/2008
Publication #:
US20090166771
Pub Dt:
07/02/2009
Title:
DEVICE COMPRISING A SENSOR MODULE
20
Patent #:
7823369
Issue Dt:
11/02/2010
Application #:
12018089
Filing Dt:
01/22/2008
Publication #:
US20080127610
Pub Dt:
06/05/2008
Title:
DEVICE FOR PACKAGING AN ELECTRONIC COMPONENT
21
Patent #:
7825526
Issue Dt:
11/02/2010
Application #:
12088713
Filing Dt:
06/24/2008
Publication #:
US20100006992
Pub Dt:
01/14/2010
Title:
FINE-PITCH ROUTING IN A LEAD FRAME BASED SYSTEM-IN-PACKAGE (SIP) DEVICE
22
Patent #:
7709954
Issue Dt:
05/04/2010
Application #:
12090686
Filing Dt:
11/18/2008
Publication #:
US20090072397
Pub Dt:
03/19/2009
Title:
REDISTRIBUTION LAYER FOR WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD THEREFOR
23
Patent #:
7884289
Issue Dt:
02/08/2011
Application #:
12297022
Filing Dt:
10/14/2008
Publication #:
US20090159331
Pub Dt:
06/25/2009
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE
24
Patent #:
8097521
Issue Dt:
01/17/2012
Application #:
12815954
Filing Dt:
06/15/2010
Publication #:
US20100251542
Pub Dt:
10/07/2010
Title:
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT AND A CAPACITANCE ELEMENT
Assignor
1
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
Exec Dt:
08/26/2015
Assignee
1
XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
2711 CENTERVILLE RD
SUITE 400
WILMINGTON, DELAWARE 19808
Correspondence name and address
MEYERTONS HOOD KIVLIN KOWERT&GOETZEL PC
1120 S. CAPITAL OF TEXAS HWY.
BUILDING 2, SUITE 300
AUSTIN, TX 78746

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