Total properties:
24
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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09440595
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Filing Dt:
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11/15/1999
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Publication #:
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Pub Dt:
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06/27/2002
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Title:
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MULTIPLE SEMICONDUCTOR CHIP (MULTI-CHIP) MODULE FOR USE IN HIGH-POWER APPLICATIONS
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09649673
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Filing Dt:
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08/28/2000
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Title:
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DATA CARRIER WITH AN INTEGRATED ELECTRONIC COMPONENT AND WITH A TRANSMISSION COLL WHICH COMPRISES TURN PORTIONS ARRANGED DIRECTLY AGAINST SAID COMPONENT
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Patent #:
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Issue Dt:
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04/12/2005
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Application #:
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09829797
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Filing Dt:
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04/10/2001
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Publication #:
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Pub Dt:
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11/29/2001
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Title:
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SEMICONDUCTOR DEVICE WITH ISOLATED INTERMETAL DIELECTRICS
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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09884223
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Filing Dt:
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06/19/2001
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Publication #:
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Pub Dt:
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12/19/2002
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Title:
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SEMICONDUCTOR MODULE HAVING MULTIPLE SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
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01/20/2004
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Application #:
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09915677
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Filing Dt:
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07/26/2001
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Publication #:
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Pub Dt:
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03/28/2002
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Title:
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SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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11/04/2003
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Application #:
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09973317
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Filing Dt:
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10/09/2001
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Publication #:
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Pub Dt:
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06/20/2002
| | | | |
Title:
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MODULE HAVING A LEAD FRAME EQUIPPED WITH COMPONENTS ON BOTH SIDES
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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10005689
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Filing Dt:
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11/08/2001
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Publication #:
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Pub Dt:
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05/08/2003
| | | | |
Title:
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CHIP-MOUNTED CONTACT SPRINGS
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Patent #:
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Issue Dt:
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09/09/2003
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Application #:
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10015720
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Filing Dt:
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11/30/2001
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Publication #:
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Pub Dt:
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07/04/2002
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Title:
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ASSEMBLY WITH CONNECTING STRUCTURE
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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10282450
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Filing Dt:
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10/29/2002
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Publication #:
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Pub Dt:
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04/29/2004
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Title:
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JUNCTION TEMPERATURES MEASUREMENTS IN SEMICONDUCTOR CHIP PACKAGE TECHNOLOGY
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Patent #:
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Issue Dt:
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07/19/2005
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Application #:
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10301200
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Filing Dt:
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11/21/2002
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Publication #:
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Pub Dt:
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05/29/2003
| | | | |
Title:
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MULTI-CHIP MODULE SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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04/18/2006
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Application #:
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10492120
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Filing Dt:
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10/11/2004
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Publication #:
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Pub Dt:
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03/24/2005
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Title:
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ELECTRICAL OR ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME
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Patent #:
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Issue Dt:
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03/11/2008
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Application #:
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10497644
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Filing Dt:
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06/04/2004
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Publication #:
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Pub Dt:
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02/17/2005
| | | | |
Title:
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METHOD OF AND DEVICE FOR PACKAGING ELECTRONIC COMPONENTS THUS PACKAGED
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Patent #:
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Issue Dt:
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03/28/2006
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Application #:
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10504752
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Filing Dt:
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08/17/2004
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Publication #:
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Pub Dt:
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06/02/2005
| | | | |
Title:
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DEVICE FOR FORMING CONNECTION ELEMENTS
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Patent #:
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Issue Dt:
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08/19/2008
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Application #:
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10525594
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Filing Dt:
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02/25/2005
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Publication #:
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Pub Dt:
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11/24/2005
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Title:
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WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDING TOOL
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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10548297
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Filing Dt:
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09/06/2005
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Publication #:
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Pub Dt:
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09/14/2006
| | | | |
Title:
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SEMICONDUCTOR DEVICE, SEMICONDUCTOR BODY AND METHOD OF MANUFACTURING THEREOF
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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11351746
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Filing Dt:
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02/10/2006
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Publication #:
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Pub Dt:
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06/15/2006
| | | | |
Title:
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ELECTRICAL OR ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME
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|
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Patent #:
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|
Issue Dt:
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06/09/2009
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Application #:
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11632518
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Filing Dt:
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11/05/2007
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Publication #:
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Pub Dt:
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08/14/2008
| | | | |
Title:
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ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT
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|
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Patent #:
|
|
Issue Dt:
|
07/06/2010
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Application #:
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11632887
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Filing Dt:
|
05/15/2008
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Publication #:
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|
Pub Dt:
|
01/15/2009
| | | | |
Title:
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ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT AND A CAPACITANCE ELEMENT
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Patent #:
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|
Issue Dt:
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09/28/2010
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Application #:
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11913585
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Filing Dt:
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10/24/2008
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Publication #:
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Pub Dt:
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07/02/2009
| | | | |
Title:
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DEVICE COMPRISING A SENSOR MODULE
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Patent #:
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Issue Dt:
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11/02/2010
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Application #:
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12018089
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Filing Dt:
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01/22/2008
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Publication #:
|
|
Pub Dt:
|
06/05/2008
| | | | |
Title:
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DEVICE FOR PACKAGING AN ELECTRONIC COMPONENT
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|
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Patent #:
|
|
Issue Dt:
|
11/02/2010
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Application #:
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12088713
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Filing Dt:
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06/24/2008
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Publication #:
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Pub Dt:
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01/14/2010
| | | | |
Title:
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FINE-PITCH ROUTING IN A LEAD FRAME BASED SYSTEM-IN-PACKAGE (SIP) DEVICE
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Patent #:
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Issue Dt:
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05/04/2010
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Application #:
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12090686
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Filing Dt:
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11/18/2008
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Publication #:
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Pub Dt:
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03/19/2009
| | | | |
Title:
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REDISTRIBUTION LAYER FOR WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD THEREFOR
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|
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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12297022
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Filing Dt:
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10/14/2008
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Publication #:
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Pub Dt:
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06/25/2009
| | | | |
Title:
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METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE
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|
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Patent #:
|
|
Issue Dt:
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01/17/2012
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Application #:
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12815954
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Filing Dt:
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06/15/2010
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Publication #:
|
|
Pub Dt:
|
10/07/2010
| | | | |
Title:
|
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT AND A CAPACITANCE ELEMENT
|
|