Patent Assignment Details
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Reel/Frame: | 008933/0686 | |
| Pages: | 4 |
| | Recorded: | 01/16/1998 | | |
Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/09/1997
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Application #:
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08598882
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Filing Dt:
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02/09/1996
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Title:
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METHOD FOR FORMING AN ELECTRICAL CONNECTION TO A SEMICONDUCTOR DIE USING LOOSE LEAD WIRE BONDING
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Assignee
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LEGAL DEPARTMENT, M/S 507 |
8000 SOUTH FEDERAL WAY |
BOISE, IDAHO 83706 |
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Correspondence name and address
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STEPHEN A. GRATTON
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2764 SOUTH BRAUN WAY
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LAKEWOOD, COLORADO 80228
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