Patent Assignment Details
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Reel/Frame: | 034777/0687 | |
| Pages: | 3 |
| | Recorded: | 01/21/2015 | | |
Attorney Dkt #: | SE-US145494 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14601952
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Filing Dt:
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01/21/2015
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Publication #:
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Pub Dt:
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08/13/2015
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Title:
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SINTER MOLD MATERIAL, SINTERING AND MOLDING METHOD, SINTER MOLD OBJECT, AND SINTERING AND MOLDING APPARATUS
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Assignee
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4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU |
TOKYO, JAPAN 163-0811 |
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Correspondence name and address
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GLOBAL IP COUNSELORS, LLP DAVID TARNOFF
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1233 20TH STREET, NW, SUITE 700
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SUITE 700
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WASHINGTON, DC 20036-2680
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09/24/2024 07:00 PM
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