Patent Assignment Details
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Reel/Frame: | 063371/0687 | |
| Pages: | 3 |
| | Recorded: | 04/19/2023 | | |
Attorney Dkt #: | 066160/584766 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18132571
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Filing Dt:
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04/10/2023
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Publication #:
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Pub Dt:
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11/02/2023
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Title:
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FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
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Assignee
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9 DONGSHENG WEST ROAD |
JIANGYIN CITY, JIANGSU PROVINCE, CHINA 214437 |
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Correspondence name and address
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ALSTON & BIRD
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101 SOUTH TRYON STREET, SUITE 4000
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BANK OF AMERICA PLAZA
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CHARLOTTE, NC 28280-4000
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06/03/2024 05:24 AM
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