Patent Assignment Details
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Reel/Frame: | 026071/0690 | |
| Pages: | 3 |
| | Recorded: | 04/04/2011 | | |
Attorney Dkt #: | 5900/0243PUS1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13079306
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Filing Dt:
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04/04/2011
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Publication #:
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Pub Dt:
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05/10/2012
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Title:
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FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER CUTTING TECHNIQUES
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Assignee
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NO. 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK |
KUEI SHAN HSIANG |
TAO YUAN SHIEN, TAIWAN |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, PLLC
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4000 LEGATO ROAD
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SUITE 310
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FAIRFAX, VA 22033
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