Patent Assignment Details
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Reel/Frame: | 036790/0690 | |
| Pages: | 2 |
| | Recorded: | 10/14/2015 | | |
Attorney Dkt #: | 1248/319A |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/09/2018
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Application #:
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14877806
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Filing Dt:
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10/07/2015
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Publication #:
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Pub Dt:
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04/07/2016
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Title:
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CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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Assignee
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9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
JHONGLI DIST. |
TAOYUAN CITY, TAIWAN 32062 |
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Correspondence name and address
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WEN LIU
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350 S. FIGUEROA STREET, SUITE 975
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LOS ANGELES, CA 90071
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