Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 051405/0692 | |
| Pages: | 4 |
| | Recorded: | 01/02/2020 | | |
Attorney Dkt #: | 102351-1466 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2022
|
Application #:
|
16675011
|
Filing Dt:
|
11/05/2019
|
Publication #:
|
|
Pub Dt:
|
05/06/2021
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE PILLARS AND REINFORCING AND ENCAPSULATING LAYERS
|
|
Assignee
|
|
|
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
|
Correspondence name and address
|
|
FOLEY & LARDNER LLP
|
|
3000 K STREET, N.W.
|
|
SUITE 600
|
|
WASHINGTON, DC 20007
|
Search Results as of:
09/26/2024 04:51 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|