Patent Assignment Details
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| Reel/Frame: | 038391/0693 | |
| Pages: | 3 |
| | Recorded: | 04/27/2016 | | |
| Attorney Dkt #: | CUL-030BC1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/09/2017
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Application #:
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14952294
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Filing Dt:
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11/25/2015
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Publication #:
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Pub Dt:
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03/24/2016
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Title:
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WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
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Assignee
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| 13551 COMMERCE PARKWAY |
| SUITE 120 |
| RICHMOND, BRITISH COLUMBIA, CANADA V6V 2L1 |
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Correspondence name and address
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MORGAN, LEWIS, & BOCKIOUS LLP (B0)
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1111 PENNSYLVANIA AVENUE, NW​
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WASHINGTON, DC 20004-2541
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