Patent Assignment Details
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Reel/Frame: | 044590/0693 | |
| Pages: | 3 |
| | Recorded: | 01/10/2018 | | |
Attorney Dkt #: | TWT05720/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/31/2018
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Application #:
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15866483
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Filing Dt:
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01/10/2018
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Publication #:
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Pub Dt:
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05/10/2018
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Title:
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METHOD FOR FORMING SEMICONDUCTOR PACKAGE
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Assignee
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NO.98, NANLIN RD., TAISHAN DIST. |
NEW TAIPEI CITY, TAIWAN 243 |
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Correspondence name and address
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CKC & PARTNERS CO., LTD.
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ROOM 1901, 19/F, LEE GARDEN ONE,
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33 HYSAN AVENUE, CAUSEWAY BAY
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HONG KONG, HONG KONG
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