Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 022366/0694 | |
| Pages: | 3 |
| | Recorded: | 03/09/2009 | | |
Attorney Dkt #: | NSC1P379 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/08/2009
|
Application #:
|
11897971
|
Filing Dt:
|
08/30/2007
|
Publication #:
|
|
Pub Dt:
|
03/05/2009
| | | | |
Title:
|
HIGH STRENGTH SOLDER JOINT FORMATION METHOD FOR WAFER LEVEL PACKAGES AND FLIP APPLICATIONS
|
|
Assignee
|
|
|
2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
|
Correspondence name and address
|
|
BEYER LAW GROUP LLP
|
|
P.O. BOX 1687
|
|
CUPERTINO, CA 95015-1687
|
Search Results as of:
09/23/2024 12:21 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|