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Reel/Frame:019184/0695   Pages: 9
Recorded: 04/18/2007
Attorney Dkt #:JCLA22783
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11736904
Filing Dt:
04/18/2007
Publication #:
Pub Dt:
10/23/2008
Title:
METHOD OF REMOVING PHOTORESIST LAYER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
Assignors
1
Exec Dt:
04/16/2007
2
Exec Dt:
04/16/2007
3
Exec Dt:
04/16/2007
4
Exec Dt:
04/16/2007
5
Exec Dt:
04/16/2007
6
Exec Dt:
04/16/2007
7
Exec Dt:
04/16/2007
8
Exec Dt:
04/16/2007
9
Exec Dt:
04/16/2007
10
Exec Dt:
04/16/2007
Assignee
1
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondence name and address
J.C. PATENTS
4 VENTURE, SUITE 250
IRVINE, CA 92618

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