Patent Assignment Details
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Reel/Frame: | 052100/0696 | |
| Pages: | 16 |
| | Recorded: | 03/12/2020 | | |
Attorney Dkt #: | 5440/0525PUS1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16816108
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Filing Dt:
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03/11/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Title:
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DIE BONDING PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY
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Assignee
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NO. 841-899, MIN AN ROA, HONGTANG TOWN, TONGAN DISTRICT |
XIAMEN, FUJIAN, CHINA |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, P.C.
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4000 LEGATO ROAD
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SUITE 310
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FAIRFAX, VA 22033
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05/29/2024 10:05 AM
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