Patent Assignment Details
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| Reel/Frame: | 060419/0696 | |
| Pages: | 2 |
| | Recorded: | 07/01/2022 | | |
| Attorney Dkt #: | 22562-5809 / 2017-439 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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16866050
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Filing Dt:
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05/04/2020
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Publication #:
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Pub Dt:
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08/20/2020
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Title:
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MULTI-LAYER COOLING STRUCTURE INCLUDING THROUGH-SILICON VIAS THROUGH A PLURALITY OF DIRECTLY-BONDED SUBSTRATES AND METHODS OF MAKING THE SAME
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Assignee
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| 1, TOYOTA-CHO, TOYOTA-SHI |
| AICHI-KEN, JAPAN 471-8571 |
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Correspondence name and address
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DINSMORE & SHOHL LLP
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255 E. FIFTH STREET
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SUITE 1900
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CINCINNATI, OH 45202
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