Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051583/0697 | |
| Pages: | 3 |
| | Recorded: | 01/22/2020 | | |
| Attorney Dkt #: | 22272-45113/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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16748633
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Filing Dt:
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01/21/2020
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Publication #:
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Pub Dt:
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04/15/2021
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Title:
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HIGH DENSITY LOW POWER INTERCONNECT USING 3D DIE STACKING
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Assignee
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| 2130 GOLD STREET |
| SUITE 100 |
| SAN JOSE, CALIFORNIA 95002 |
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Correspondence name and address
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JORGE KINA
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FENWICK & WEST LLP
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801 CALIFORNIA STREET
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MOUNTAIN VIEW, CA 94041
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06/23/2024 10:19 AM
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