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NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:051836/0697   Pages: 8
Recorded: 02/06/2020
Conveyance: SECURITY AGREEMENT
Total properties: 33
1
Patent #:
6373682
Issue Dt:
04/16/2002
Application #:
09464010
Filing Dt:
12/15/1999
Title:
ELECTROSTATICALLY CONTROLLED VARIABLE CAPACITOR
2
Patent #:
6456420
Issue Dt:
09/24/2002
Application #:
09626725
Filing Dt:
07/27/2000
Title:
MICROELECTROMECHANICAL ELEVATING STRUCTURES
3
Patent #:
6377438
Issue Dt:
04/23/2002
Application #:
09694835
Filing Dt:
10/23/2000
Title:
Hybrid microelectromechanical system tunable capacitor and associated fabrication methods
4
Patent #:
6396620
Issue Dt:
05/28/2002
Application #:
09702082
Filing Dt:
10/30/2000
Title:
ELECTROSTATICALLY ACTUATED ELECTROMAGNETIC RADIATION SHUTTER
5
Patent #:
6731492
Issue Dt:
05/04/2004
Application #:
10139527
Filing Dt:
05/06/2002
Publication #:
US20040017644
Pub Dt:
01/29/2004
Title:
OVERDRIVE STRUCTURES FOR FLEXIBLE ELECTROSTATIC SWITCH
6
Patent #:
6752868
Issue Dt:
06/22/2004
Application #:
10210010
Filing Dt:
07/31/2002
Publication #:
US20040020423
Pub Dt:
02/05/2004
Title:
LAYER-BY-LAYER ASSEMBLY OF PHOTONIC CRYSTALS
7
Patent #:
7042306
Issue Dt:
05/09/2006
Application #:
10884963
Filing Dt:
07/07/2004
Publication #:
US20040246065
Pub Dt:
12/09/2004
Title:
THREE DIMENSIONAL MULTIMODE AND OPTICAL COUPLING DEVICES
8
Patent #:
8198974
Issue Dt:
06/12/2012
Application #:
11578556
Filing Dt:
12/20/2007
Publication #:
US20080123171
Pub Dt:
05/29/2008
Title:
FLEXIBLE ELECTROSTATIC ACTUATOR
9
Patent #:
8035223
Issue Dt:
10/11/2011
Application #:
11846253
Filing Dt:
08/28/2007
Publication #:
US20090057879
Pub Dt:
03/05/2009
Title:
STRUCTURE AND PROCESS FOR ELECTRICAL INTERCONNECT AND THERMAL MANAGEMENT
10
Patent #:
7709966
Issue Dt:
05/04/2010
Application #:
11952495
Filing Dt:
12/07/2007
Publication #:
US20090079056
Pub Dt:
03/26/2009
Title:
LARGE SUBSTRATE STRUCTURAL VIAS
11
Patent #:
7829994
Issue Dt:
11/09/2010
Application #:
11975007
Filing Dt:
10/16/2007
Publication #:
US20090079058
Pub Dt:
03/26/2009
Title:
SEMICONDUCTOR SUBSTRATE ELASTOMERIC STACK
12
Patent #:
7764498
Issue Dt:
07/27/2010
Application #:
11975011
Filing Dt:
10/16/2007
Publication #:
US20090080158
Pub Dt:
03/26/2009
Title:
COMB-SHAPED POWER BUS BAR ASSEMBLY STRUCTURE HAVING INTEGRATED CAPACITORS
13
Patent #:
7999388
Issue Dt:
08/16/2011
Application #:
11975058
Filing Dt:
10/16/2007
Publication #:
US20090079084
Pub Dt:
03/26/2009
Title:
PREVENTING BREAKAGE OF LONG METAL SIGNAL CONDUCTORS ON SEMICONDUCTOR SUBSTRATES
14
Patent #:
7944041
Issue Dt:
05/17/2011
Application #:
11975966
Filing Dt:
10/22/2007
Publication #:
US20090079059
Pub Dt:
03/26/2009
Title:
INTEGRATED SEMICONDUCTOR SUBSTRATE STRUCTURE USING INCOMPATIBLE PROCESSES
15
Patent #:
7831874
Issue Dt:
11/09/2010
Application #:
11981853
Filing Dt:
10/31/2007
Publication #:
US20090079463
Pub Dt:
03/26/2009
Title:
LOCAL DEFECT MEMORIES ON SEMICONDUCTOR SUBSTRATES IN A STACK COMPUTER
16
Patent #:
8129834
Issue Dt:
03/06/2012
Application #:
12321833
Filing Dt:
01/26/2009
Publication #:
US20100187665
Pub Dt:
07/29/2010
Title:
INTEGRAL METAL STRUCTURE WITH CONDUCTIVE POST PORTIONS
17
Patent #:
7978029
Issue Dt:
07/12/2011
Application #:
12387873
Filing Dt:
05/09/2009
Publication #:
US20100283559
Pub Dt:
11/11/2010
Title:
MULTIPLE-LAYER SIGNAL CONDUCTOR
18
Patent #:
8361901
Issue Dt:
01/29/2013
Application #:
12754396
Filing Dt:
04/05/2010
Publication #:
US20100270685
Pub Dt:
10/28/2010
Title:
DIE BONDING UTILIZING A PATTERNED ADHESION LAYER
19
Patent #:
8008134
Issue Dt:
08/30/2011
Application #:
12798874
Filing Dt:
04/12/2010
Publication #:
US20100200540
Pub Dt:
08/12/2010
Title:
LARGE SUBSTRATE STRUCTURAL VIAS
20
Patent #:
8222086
Issue Dt:
07/17/2012
Application #:
13065976
Filing Dt:
04/04/2011
Publication #:
US20110183469
Pub Dt:
07/28/2011
Title:
INTEGRATED SEMICONDUCTOR SUBSTRATE STRUCTURE USING INCOMPATIBLE PROCESSES
21
Patent #:
8404585
Issue Dt:
03/26/2013
Application #:
13135510
Filing Dt:
07/07/2011
Publication #:
US20110266034
Pub Dt:
11/03/2011
Title:
Preventing breakage of long metal signal conductors on semiconductor substrates
22
Patent #:
8975753
Issue Dt:
03/10/2015
Application #:
13202187
Filing Dt:
08/18/2011
Publication #:
US20110298134
Pub Dt:
12/08/2011
Title:
THREE DIMENSIONAL INTERCONNECT STRUCTURE AND METHOD THEREOF
23
Patent #:
8486765
Issue Dt:
07/16/2013
Application #:
13238975
Filing Dt:
09/21/2011
Publication #:
US20120048596
Pub Dt:
03/01/2012
Title:
Structure And Process For Electrical Interconnect And Thermal Management
24
Patent #:
9022649
Issue Dt:
05/05/2015
Application #:
13645765
Filing Dt:
10/05/2012
Publication #:
US20130034122
Pub Dt:
02/07/2013
Title:
FLUORESCENCE BASED THERMOMETRY
25
Patent #:
9437796
Issue Dt:
09/06/2016
Application #:
13725156
Filing Dt:
12/21/2012
Publication #:
US20130186449
Pub Dt:
07/25/2013
Title:
RARE EARTH-DOPED MATERIALS WITH ENHANCED THERMOELECTRIC FIGURE OF MERIT
26
Patent #:
8766656
Issue Dt:
07/01/2014
Application #:
13865005
Filing Dt:
04/17/2013
Publication #:
US20130285686
Pub Dt:
10/31/2013
Title:
Systems and Methods for Thermal Control
27
Patent #:
9576889
Issue Dt:
02/21/2017
Application #:
14408887
Filing Dt:
12/17/2014
Publication #:
US20150187691
Pub Dt:
07/02/2015
Title:
THREE-DIMENSIONAL ELECTRONIC PACKAGES UTILIZING UNPATTERNED ADHESIVE LAYER
28
Patent #:
10125599
Issue Dt:
11/13/2018
Application #:
14417674
Filing Dt:
01/27/2015
Publication #:
US20150211358
Pub Dt:
07/30/2015
Title:
LOCATION OF SENSORS IN WELL FORMATIONS
29
Patent #:
9257335
Issue Dt:
02/09/2016
Application #:
14426302
Filing Dt:
03/05/2015
Publication #:
US20150235898
Pub Dt:
08/20/2015
Title:
ELECTRONIC DEVICES UTILIZING CONTACT PADS WITH PROTRUSIONS AND METHODS FOR FABRICATION
30
Patent #:
10209175
Issue Dt:
02/19/2019
Application #:
15223346
Filing Dt:
07/29/2016
Publication #:
US20170030825
Pub Dt:
02/02/2017
Title:
DETECTION OF CORROSION USING DISPERSED EMBEDDED SENSORS
31
Patent #:
9881905
Issue Dt:
01/30/2018
Application #:
15304858
Filing Dt:
10/17/2016
Publication #:
US20170207198
Pub Dt:
07/20/2017
Title:
ELECTRONIC PACKAGES WITH THREE-DIMENSIONAL CONDUCTIVE PLANES, AND METHODS FOR FABRICATION
32
Patent #:
10418344
Issue Dt:
09/17/2019
Application #:
15881238
Filing Dt:
01/26/2018
Publication #:
US20180151542
Pub Dt:
05/31/2018
Title:
ELECTRONIC PACKAGES WITH THREE-DIMENSIONAL CONDUCTIVE PLANES, AND METHODS FOR FABRICATION
33
Patent #:
10845297
Issue Dt:
11/24/2020
Application #:
16277287
Filing Dt:
02/15/2019
Publication #:
US20190178784
Pub Dt:
06/13/2019
Title:
DETECTION OF CORROSION USING DISPERSED EMBEDDED SENSORS
Assignors
1
MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Exec Dt:
02/05/2020
2
SILICON TURNKEY SOLUTIONS, INC.
Exec Dt:
02/05/2020
Assignee
1
ALLY BANK, AS ASSIGNEE
300 PARK AVENUE
4TH FLOOR
NEW YORK, NEW YORK 10022
Correspondence name and address
CT CORPORATION
4400 EASTON COMMONS WAY
SUITE 125
COLUMBUS, OH 43219

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