Patent Assignment Details
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| Reel/Frame: | 054407/0698 | |
| Pages: | 5 |
| | Recorded: | 11/18/2020 | | |
| Attorney Dkt #: | JCLA70274-D-D |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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16951361
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Filing Dt:
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11/18/2020
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Publication #:
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Pub Dt:
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03/11/2021
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
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Assignee
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| NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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J C PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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05/27/2024 01:06 PM
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