Patent Assignment Details
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Reel/Frame: | 055571/0698 | |
| Pages: | 7 |
| | Recorded: | 03/12/2021 | | |
Attorney Dkt #: | 204224/1173-679 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17188236
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Filing Dt:
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03/01/2021
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Publication #:
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Pub Dt:
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09/01/2022
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Title:
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THERMAL STRUCTURES ADAPTED TO ELECTRONIC DEVICE HEIGHTS IN INTEGRATED CIRCUIT (IC) PACKAGES
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Assignee
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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Correspondence name and address
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W&T/QUALCOMM
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106 PINEDALE SPRINGS WAY
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CARY, NC 27511
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06/21/2024 09:12 AM
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