Patent Assignment Details
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| Reel/Frame: | 042931/0701 | |
| Pages: | 4 |
| | Recorded: | 06/21/2017 | | |
| Attorney Dkt #: | 0941-3567PUS1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY STATE/COUNTRY PREVIOUSLY RECORDED ON REEL 042617 FRAME 0063. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/15/2018
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Application #:
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15613663
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Filing Dt:
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06/05/2017
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Title:
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SEMICONDUCTOR DEVICES, THROUGH-SUBSTRATE VIA STRUCTURES AND METHODS FOR FORMING THE SAME
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Assignee
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| 123, PARK AVE-3RD |
| SCIENCE - BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 30077 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD
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SUITE 100E
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FALLS CHURCH, VA 22042
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